Unlock instant, AI-driven research and patent intelligence for your innovation.

Exposure apparatus for internal substrate and method for peeling substrate and mask

A technology for exposure devices and substrates, which is applied in photolithography exposure devices, microlithography exposure equipment, photosensitive material processing, etc., and can solve the problems of time required for peeling off and difficulty in peeling off the entire substrate

Inactive Publication Date: 2014-12-10
HOWA MASCH LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, especially when the substrate is thin and soft like the inner layer substrate, since the substrate is deflected, the force is released only when peeling off by means of a pop-up pin or blowing air, and it is difficult to quickly peel off the entire substrate. need time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Exposure apparatus for internal substrate and method for peeling substrate and mask
  • Exposure apparatus for internal substrate and method for peeling substrate and mask
  • Exposure apparatus for internal substrate and method for peeling substrate and mask

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] Hereinafter, embodiments embodying the present invention will be described in detail with reference to the drawings. figure 1 It is a front view showing an example of an exposure apparatus for an inner layer substrate according to the present invention, and 1 is a substrate (such as figure 2 Shown) 10, set the exposure platform for exposing the exposure mask of the prescribed pattern on one side of the substrate 10, 2 is set for exposing the prescribed pattern on the other side of the substrate 10 The upper frame of the exposure mask above, 3 is the input carrier for putting the substrate 10 onto the exposure platform 1, 4 is the input conveyor, 5 is the discharge carrier for discharging the exposed substrate 10, and 6 is the discharge carrier. Conveyors, 7 (7a, 7b) are UV irradiation devices, 12a is a lower side pusher for peeling the substrate 10 close to the exposure platform 1, and 12b is an upper pusher for peeling the substrate 10 close to the upper frame 2. sid...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an exposure apparatus for an internal substrate and a method for peeling the substrate and a mask, to enable the substrate to be peeled from the exposure mask really as early as possible. According to the invention, on an exposure platform (1) and an upper frame (2), a propeller (12) for performing the projecting motion to press one end of the substrate (10) to be peeled off from the exposure mask (11) is arranged, a jet nozzle (2) for spraying the gas between the substrate (10) and the exposure mask (11) is formed on the propeller (12). the propeller (12) is arranged at the part where the end of the substrate (10) is pressed, the jet nozzle (21) is formed to spray the gas to the center of the substrate (10) as a peeling object, and the gas from the jet nozzle (21) is an ionized gas with the anti-static function.

Description

technical field [0001] The present invention relates to an exposure apparatus for an inner layer substrate used in a step of exposing an inner layer substrate by bringing a mask into close contact with the inner layer substrate, and a method for peeling off a substrate and a mask in the exposure apparatus. Background technique [0002] The exposure apparatus for the inner layer substrate is configured in such a way that one exposure mask is set on the exposure mask holding plate assembled on the exposure stage, and one exposure mask is set on the upper frame arranged above it. Set another exposure mask on the holding plate, arrange the substrate between the two exposure masks, and expose the front and back of the substrate simultaneously by the UV irradiation device arranged under the exposure mask holding plate and above the upper frame . [0003] Briefly explain the conventional exposure process of this exposure device for inner layer substrates. The substrates that have ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G03F7/36
Inventor 猿渡义德
Owner HOWA MASCH LTD