Solid-state imaging device and camera

Abstract

A solid-state imaging device and a camera includes: an imaging unit wherein a plurality of light sensing units formed in a matrix and a plurality of interconnections are formed among the plurality of light sensing units; a color filter that is disposed over the imaging unit, and delivers colors to the light sensing units in accordance with a predefined rule; and on-chip lenses that are disposed corresponding to the light sensing units on a one-by-one basis over the color filter, and have light-collection characteristics varying in accordance with differences among sensitivities of the light sensing units, where the differences among the sensitivities of the light sensing units are generated, when the same colors are delivered to the light sensing units in accordance with the same rule, owing to the fact that positions of the individual interconnections relative to the light sensing units vary periodically. Both the miniaturization and the suppression of the deterioration of the image quality can be realized.

Description

[0001] Cross References to Related Applications [0002] This application contains subject matter related to the disclosure of Japanese Priority Patent Application JP 2009-171674 filed in Japan Patent Office on Jul. 23, 2009, the entire content of which is hereby incorporated by reference In this article. technical field [0003] The present invention relates to a solid-state imaging device and a camera, and more specifically, to a solid-state imaging device in which the positional relationship between a photosensitive unit and a wiring layer changes periodically, and a camera equipped with the solid-state imaging device. Background technique [0004] In recent years, CMOS-type solid-state imaging devices employing complementary metal oxide semiconductor (CMOS) technology, which is a standard technology of IC manufacturing, are widely used. [0005] Unlike charge coupled device (CCD) solid-state imaging devices, CMOS-type solid-state imaging devices do not use a high drivin...

AI Technical Summary

Problems solved by technology

Therefore, since the photo-sensing units and the wiring layers are not regularly arranged, or in other words, since the pattern constituted by the photo-sensing units and the wiring layers is a non-uniform pattern, the sensitivity of each photo-sensing unit changes periodically, resulting in a loss from the solid-state imaging device. Periodic degradation of image quality in the output image signal

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