Graphical Structure and Method of Insulation Reliability Test of PCB Finished Products

A graphic structure, PCB board technology, used in measuring devices, measuring electrical variables, measuring resistance/reactance/impedance, etc., can solve the problem of not being able to test the insulation performance parameters of PCB boards in batches, accurately and comprehensively, to avoid PCB micro The effect of short-circuit-like phenomena

Inactive Publication Date: 2016-12-07
SHENZHEN SKYWORTH DIGITAL TECH CO LTD
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  • Abstract
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Problems solved by technology

[0004] In order to solve the technical problem that the existing technology cannot detect the insulation performance parameters of the PCB board in batches, accurately and comprehensively, the present invention proposes a design test pattern using the position of the existing process edge, which is used to accurately evaluate the PCB design, board material, and process flow The graphic structure and method of the insulation reliability test of the finished PCB board whether it can meet the electrical performance requirements

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  • Graphical Structure and Method of Insulation Reliability Test of PCB Finished Products

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Embodiment Construction

[0017] Such as figure 1 Shown is the graphic structure diagram of the reliability test of the preferred embodiment of the present invention, the graphic structure of the finished product insulation reliability test of the PCB board, which includes a PCB board 1, a process edge located on one side of the PCB board 2. The process side 2 is provided with multiple rows of via holes and pads, each row of via holes and pads are connected to form a network through a wire, and a network pad is provided at one end of the network wire. In this embodiment, the thickness of the PCB board 1 is 1.6mm, and the length and width are 100mm×200mm. The process edge is set on the upper end of the PCB board, generally larger than 5mm. The via holes are four pairs of eight holes 3, 4, 5, 6, 7, 8, 9, 10, arranged in two rows up and down. The pads 11, 12 are a pair arranged up and down. The first row of via holes 3 , 5 , 7 , 9 and the first pad 11 are connected to form a first network through a fi...

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Abstract

The invention discloses a graphic structure for testing the insulation reliability of PCB board products, which comprises a PCB board (1) and a process edge (2) arranged on one side of the PCB board. The process side (2) is provided with multiple rows of via holes and pads, each row of via holes and pads are connected to form a network through a wire, and a network pad is provided at one end of the network wire. The sliding cover of the invention discloses a method for testing the insulation reliability of PCB board products. The invention can effectively and accurately test whether the design, board material and process flow of each PCB can meet the requirements of electrical performance in batches, and accurately evaluate the insulation performance of different PCB boards, so as to prevent PCB micro-short circuit caused by unqualified products entering the market. failure phenomenon. Sampling and small-batch testing can also be realized. Using this test method in the early stage of PCB design and mass production can avoid similar phenomena of PCB micro-short circuit.

Description

technical field [0001] The present invention relates to the insulation reliability testing technology of finished PCB boards, in particular to a design test pattern using the position of the existing process edge, which is used to accurately evaluate whether the PCB design, board material and process flow can meet the electrical performance requirements of the finished PCB board insulation reliability Graphical structure and method for sex testing. Background technique [0002] Before the existing PCB board is shipped by the manufacturer, the electrical test of the circuit or disconnection is generally carried out on the PCB board, but the insulation resistance cannot be directly detected, and only the test data of the insulation resistance of the PCB board can be referred to. However, after the PCB board has gone through a series of mechanical and wet processing, etc., the dielectric insulation resistance between the conductors of the PCB board has changed (such as the dens...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/11G01R27/02
Inventor 黄越
Owner SHENZHEN SKYWORTH DIGITAL TECH CO LTD
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