Graphic structure and method for insulation reliability test of finished PCB

A technology of PCB board and graphic structure, which is applied in the directions of measuring devices, measuring electrical variables, measuring resistance/reactance/impedance, etc., can solve the problems of inability to batch, accurately and comprehensively detect the insulation performance parameters of PCB boards, and avoid PCB micro The effect of a short-circuit-like phenomenon

Inactive Publication Date: 2011-03-02
SHENZHEN SKYWORTH DIGITAL TECH CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problem that the existing technology cannot detect the insulation performance parameters of the PCB board in batches, accurately and comprehensively, the present invention proposes a design test pattern using the position of the existing process edge, which is used to accurately evaluate the PCB design, board material, and process flow The graphic structure and method of the insulation reliability test of the finished PCB board whether it can meet the electrical performance requirements

Method used

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  • Graphic structure and method for insulation reliability test of finished PCB
  • Graphic structure and method for insulation reliability test of finished PCB

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Embodiment Construction

[0017] Such as figure 1 Shown is the graphic structure diagram of the reliability test of the preferred embodiment of the present invention, the graphic structure of the finished product insulation reliability test of the PCB board, which includes a PCB board 1, a process edge located on one side of the PCB board 2. The process side 2 is provided with multiple rows of via holes and pads, each row of via holes and pads are connected to form a network through a wire, and a network pad is provided at one end of the network wire. In this embodiment, the thickness of the PCB board 1 is 1.6mm, and the length and width are 100mm×200mm. The process edge is set on the upper end of the PCB board, generally larger than 5mm. The via holes are four pairs of eight holes 3, 4, 5, 6, 7, 8, 9, 10, arranged in two rows up and down. The pads 11, 12 are a pair arranged up and down. The first row of via holes 3 , 5 , 7 , 9 and the first pad 11 are connected to form a first network through a fi...

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Abstract

The invention discloses a graphic structure for insulation reliability test of a finished PCB, comprising a PCB (1) and a technology edge (2) arranged at one side of the PCB. The graphic structure is characterized in that the technology edge (2) is provided with a plurality of rows of through holes and pads; each row of through holes and pads is connected into a network by a conductor; and a network pad is arranged at one end of the network conductor. The invention also discloses a method for insulation reliability test of the finished PCB. The invention can effectively and accurately test whether the design, materials and technology flow of each PCB can meet the requirement of electrical performance in batch and accurately assess the insulating performances of different PCB so as to stop micro short circuit of the PCB and product failure occurring after unqualified products enter into the markets. The invention can realize small batch test of the samples. The phenomenon similar to micro short circuit of the PCB can be avoided by adopting the method in the earlier stage of PCB design and batch production.

Description

technical field [0001] The present invention relates to the insulation reliability testing technology of finished PCB boards, in particular to a design test pattern using the position of the existing process edge, which is used to accurately evaluate whether the PCB design, board material and process flow can meet the electrical performance requirements of the finished PCB board insulation reliability Graphical structure and method for sex testing. Background technique [0002] Before the existing PCB board is shipped by the manufacturer, the electrical test of the circuit or disconnection is generally carried out on the PCB board, but the insulation resistance cannot be directly detected, and only the test data of the insulation resistance of the PCB board can be referred to. However, after the PCB board has gone through a series of mechanical and wet processing, etc., the dielectric insulation resistance between the conductors of the PCB board has changed (such as the dens...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11G01R27/02
Inventor 黄越
Owner SHENZHEN SKYWORTH DIGITAL TECH CO LTD
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