Processing method of antistatic adhesive tapes

A processing method and anti-static technology, applied in the direction of printed circuit components, etc., can solve the problems of tape containing harmful substances, polluting the environment, and neglecting the environmental protection problems of tape, and achieve the effect of no environmental pollution and high anti-static ability.

Inactive Publication Date: 2011-03-23
CHANGSHU CHANGJIANG TAPE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of electronic science and technology, the application of adhesive tape in the field of electronic industry has also developed by leaps and bounds. However, due to the limitations of traditional adhesive tape processing methods, various adhesive tapes have a certain amount of static electricity to varying degrees, which makes the surface of the substrate adsorbed. Dust or other particles, thereby affecting the service life of related electronic devices
Simultaneously because adhesive tape is a kind of chemical synthesis material, the processing method of prior art is mainly devoted to the improvement to the function of adhesive tape, and the environmental protection problem of adhesive tape is often ignored by people.
[0003] Therefore, there are at least the following disadvantages in the tape processing method of the prior art: (1) the processed tape has poor antistatic ability, (2) the tape itself contains harmful substances (such as heavy metals, halogens and other harmful VOC substances), polluting the environment

Method used

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  • Processing method of antistatic adhesive tapes
  • Processing method of antistatic adhesive tapes

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] S1. Select the base material

[0018] Specifically, polyimide film with high temperature resistance and good transparency is preferably selected as the base material without limitation.

[0019] S2. Apply a primer to the front of the substrate, and perform drying treatment while applying the primer, and the drying temperature is about 90°C.

[0020] Specifically, the primer is a silicone polymer; more specifically, the primer is compounded from the following raw materials in weight ratio, PSA409 additive: crosslinking agent: catalyst: dilution solvent = 1: 0.05 : 0.1: 0.01, the crosslinking agent is BPO, the catalyst is dilaurel catalyst, and the dilution solvent is an aromatic solvent. The temperature for preparing primer is normal temperature.

[0021] S3. Coating synthetic glue on the base glue, and performing drying treatment while coating the synthetic glue, the drying temperature is about 130°C.

[0022] Specifically, the synthetic glue is compounded from raw m...

Embodiment 2

[0029] S1. Select the base material

[0030] Specifically, polyimide film with high temperature resistance and good transparency is preferably selected as the base material without limitation.

[0031] S2. Apply primer to the front of the base material, and perform drying treatment while applying the primer, and the drying temperature is about 105°C.

[0032] Specifically, the primer is a silicone polymer; more specifically, the primer is compounded from the following raw materials in weight ratio, PSA409 additive: crosslinking agent: catalyst: dilution solvent = 1: 0.08 : 0.15: 0.04, the crosslinking agent is BPO, the catalyst is dilaurel catalyst, and the dilution solvent is an aromatic solvent. The temperature for preparing primer is normal temperature.

[0033] S3. Coating synthetic glue on the base glue, and performing drying treatment while coating the synthetic glue, the drying temperature is about 170°C.

[0034] Specifically, the synthetic glue is compounded from r...

Embodiment 3

[0041] S1. Select the base material

[0042] Specifically, polyimide film with high temperature resistance and good transparency is preferably selected as the base material without limitation.

[0043] S2. Apply primer to the front surface of the base material, and perform drying treatment while applying the primer, and the drying temperature is about 120°C.

[0044] Specifically, the primer is a silicone polymer; more specifically, the primer is compounded from the following raw materials in weight ratio, PSA409 additive: crosslinking agent: catalyst: dilution solvent = 1: 0.1 : 0.2: 0.08, the crosslinking agent is BPO, the catalyst is dilaurel catalyst, and the dilution solvent is an aromatic solvent. The temperature for preparing primer is normal temperature.

[0045] S3. Coating synthetic glue on the base glue, and performing drying treatment while coating the synthetic glue, and the drying temperature is about 200°C.

[0046] Specifically, the synthetic glue is compoun...

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PUM

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Abstract

The invention relates to a processing method of antistatic adhesive tapes. The processing method comprises the following steps of: selecting base materials; coating a primer on the front of the base materials and simultaneously carrying out drying processing, wherein the drying temperature is about 90 DEG C to 120 DEG C; coating a synthetic adhesive on the primer and simultaneously carrying out drying processing, wherein the drying temperature is about 130 DEG C to 200 DEG C, and the synthetic adhesive is compounded from the following raw materials in proportion by weight: 1 portion of finishing adhesive and 0.05 to 0.2 portion of antistatic adhesive; and rolling. The adhesive tapes produced by adopting the processing method have the advantages that on one hand, the surface resistance reaches 1.0*105 Omega / cm<2> so that the adhesive tapes have higher antistatic ability, and on the other hand, the adhesive tapes do not contain heavy metal, halogen and harmful VOC (volatile organic compound) substances so that environmental pollution cannot be caused.

Description

technical field [0001] The invention relates to a processing method of an adhesive tape, in particular to a processing method of an antistatic adhesive tape. Background technique [0002] With the rapid development of electronic science and technology, the application of adhesive tape in the field of electronic industry has also developed by leaps and bounds. However, due to the limitations of traditional adhesive tape processing methods, various adhesive tapes have a certain amount of static electricity to varying degrees, which makes the surface of the substrate adsorbed. dust or other particles, thereby affecting the service life of related electronic devices. Simultaneously because adhesive tape is a kind of chemical synthesis material, the processing method of prior art is mainly devoted to the improvement to the function of adhesive tape, and the environmental protection problem of adhesive tape is often ignored by people. [0003] Therefore, the tape processing metho...

Claims

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Application Information

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IPC IPC(8): H05K1/02
Inventor 张剑
Owner CHANGSHU CHANGJIANG TAPE
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