Electroplating fixture and printed wiring board electroplating system
A technology for printed circuit boards and electroplating fixtures, applied in electrolytic components, electrolytic processes, etc., to achieve the effect of protecting flatness
Active Publication Date: 2012-07-25
NEW FOUNDER HLDG DEV LLC +1
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0006] The embodiment of the present invention provides an electroplating fixture and a printed circuit board electroplating system to solve the problems existing in thin plate electroplating and improve the quality of thin plate electroplating
Method used
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Embodiment Construction
[0037] The invention provides an electroplating fixture for electroplating printed circuit boards, which is characterized in that it includes:
[0038] The conductive support includes two opposite conductive side strips, and the two conductive side strips respectively have connecting parts at the same height for connecting to the flybar as the electrolytic plating cathode;
[0039] Two upper clamping strips, each upper clamping strip has a protruding conductive part connected to the conductive strip through a wire, and the printed circuit board can be clamped on each upper clamping part through the protruding conductive part Between the side strips and the corresponding conductive side strips.
[0040] Preferably, in each embodiment of the present invention, the connecting part is specifically a hook-shaped component with an opening downward, and an end of the hook-shaped component has a screw hole for screwing in a screw.
[0041] Preferably, in each embodiment of the presen...
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Abstract
The invention discloses an electroplating fixture and a printed wiring board electroplating system. The electroplating fixture comprises a conductive support and two upper clamping edge strips, wherein the conductive support comprises two opposite conductive edge strips, the two conductive edge strips are respectively provided with a connecting part at the same height and are used for being connected with a flying handle used as an electrolysis electroplating cathode; and each upper clamping edge strip is provided with a projecting conductive part connected with the conductive strip by virtueof a lead and can clamp the printed wiring board between each upper clamping edge strip and a corresponding conductive edge strip by virtue of the projecting conductive part. In the invention, the two sides of the printed wiring circuit board are clamped during the electroplating process, thus the aim of protecting the smoothness and completeness of an electroplated thin circuit board and the uniformity of an electroplated metal layer can be achieved.
Description
technical field [0001] The invention relates to the field of printed circuit board (Printed Circuit Board, PCB) production, in particular to an electroplating fixture and a printed circuit board electroplating system. Background technique [0002] With the development requirements of multi-function, miniaturization and high performance of electronic products, the printed circuit board (Printed Circuit Board, PCB) is developing in the direction of high-level, high-density and thin core board. At the same time, the structural design is becoming more and more complicated. Some electronic products need to be laminated by multiple thin plates (thin plates need to be drilled and electroplated). In short, thin plate electroplating is indispensable in the production of PCB boards. [0003] For thin plates such as PCBs with a thickness less than 0.8mm, vertical plating is usually used for plating. The system for realizing the electroplating PCB board in the vertical electroplating m...
Claims
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IPC IPC(8): C25D17/08
Inventor 黄承明魏晓姗
Owner NEW FOUNDER HLDG DEV LLC