Printed circuit board
A technology for printed circuit boards and power supplies, applied in the directions of printed circuits, printed circuits, printed circuit components, etc., can solve the problems of signal interference, increasing the amount of electromagnetic waves, and increasing the coupling coefficient.
Inactive Publication Date: 2011-06-15
SAMSUNG ELECTRO MECHANICS CO LTD
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Here, electromagnetic distortion occurs between two adjacent signal lines, causing interference between signals transmitted through the signal lines
Also, if two adjacent signal lines overlap with the isolated part of the ground, the coupling coefficient in the overlapping area may increase
Therefore, signal attenuation becomes severe, increasing the amount of electromagnetic wave generation
Method used
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[0028] While the invention contemplates various changes and embodiments, only specific embodiments are shown in the drawings and described in detail in the specification. However, this is not intended to limit the present invention to specific practical forms, and it should be understood that all changes, equivalents and substitutions are included in the present invention without departing from the spirit and technical scope of the present invention. . In the description of the present invention, certain detailed descriptions of related arts are omitted when it is considered that they may unnecessarily obscure the essence of the present invention.
[0029] Hereinafter, printed circuit boards according to some embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Those same or corresponding components are given the same reference numerals regardless of the figure number, and repeated descriptions are omitted.
[003...
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A printed circuit board is disclosed. The printed circuit board in accordance with an embodiment of the present invention can include an insulation substrate, a first ground, which is formed on one surface of the insulation substrate and connected to a first power source, a second ground, which is formed on one surface of the insulation substrate and connected to a second power source, a separator, which separates the first ground from the second ground, a first signal line, which is stacked on at least one of the first ground and the second ground, and a second signal line, which is stacked on at least one of the first ground and the second ground and is adjacent to the first signal line. The separator can include a curved part, which is bent in between the first signal line and the second signal line.
Description
[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2009-0122512 filed with the Korean Intellectual Property Office on December 10, 2009, the entire disclosure of which is hereby incorporated by reference. technical field [0003] The invention relates to a printed circuit board. Background technique [0004] In synchronization with the development trend of highly integrated packaging substrates having higher functionality on which electronic components are mounted, demands for highly integrated packaging patterns formed on packaging substrates are increasing. As the circuit pattern becomes dense, interference may occur between signals applied to the circuit pattern, so that the circuit pattern may generate electromagnetic waves. [0005] The signal lines formed on the printed circuit board exchange electromagnetic energy with the ground while transmitting data signals. In a printed circuit board,...
Claims
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IPC IPC(8): H05K1/02
CPCH05K1/0227H05K2201/09236H05K2201/09663H05K2201/09327H05K2201/09318H05K2201/093H05K1/0262H05K1/02
Inventor 尹熙洙李东焕李敬颢金润东张修逢
Owner SAMSUNG ELECTRO MECHANICS CO LTD