Device for analyzing the beam profile of a laser beam
A technology of laser beams and beams, which is applied in measuring devices, laser welding equipment, photometry using electric radiation detectors, etc., can solve the problems of high cost of mirrors and achieve the effect of low cost
Inactive Publication Date: 2015-01-14
TRUMPF WERKZEUGMASCHINEN GMBH & CO KG
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- Application Information
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Problems solved by technology
Although the solution is compact, the combination of the functions "mirror for the laser beam" and "integrated diode for measuring the intensity profile" leads to high outlay in the manufacture of the mirror
Furthermore, the gold coating necessary for the reflection of the laser beam leads to a strong thermal coupling of adjacent diodes, ie adjacent temperature measuring points
Method used
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Embodiment Construction
[0026] figure 1 A laser processing machine 1 is shown with a laser resonator 2 for generating a laser beam 3 . The laser beam 3 is focused on a workpiece 4 by means of a beam-guiding optics system (not shown) in order to carry out laser processing on this workpiece, for example a laser welding process or a laser cutting process. In this case, laser beam 3 is deflected by 90° between laser resonator 2 and workpiece 4 on deflection mirror 5 . The deflection mirror 5 is designed as a beam splitter and reflects approximately 99% of the intensity of the incident laser beam 3 . The remaining intensity of the laser beam 3 (approximately 1%) is transmitted by the deflection mirror 5 and impinges on a device 6 for analyzing the beam profile of the laser beam 3, at Figure 2a The device is described in detail in -c.
[0027] The device 6 has a circuit board made of plastic material as carrier plate 7, as in Figure 2a As shown in , an arrangement 8 in the form of a matrix of tempera...
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Abstract
A device for analyzing a beam profile of a laser beam includes a carrier plate, a plurality of first temperature-sensitive measuring elements, in particular diodes, which are arranged in a preferably matrix-like arrangement on a first side of the carrier plate at a plurality of measuring locations, and a plurality of second temperature-sensitive measuring elements, in particular diodes, which are arranged in another preferably matrix-like arrangement on a second side of the carrier plate. One of the first measuring elements is arranged in each case opposite one of the second measuring elements and is thermally coupled to the first measuring element using strip conductors which extend through the carrier plate. Such a device can be included in a laser processing machine and used in an associated method for analyzing a beam profile of a laser beam.
Description
technical field [0001] The invention relates to a device for analyzing the beam profile of a laser beam, a laser processing machine having at least one such device, and a corresponding method for analyzing the beam profile of a laser beam. Background technique [0002] In laser processing machines, it is necessary to measure properties of the laser beam (ideally in-line, ie during laser processing) such as power, beam position and beam diameter and / or intensity distribution. There are already commercially available measuring devices for this purpose, but these are often only suitable for use in laboratories due to their price and their low robustness. In one such measuring instrument, a small, fast-moving needle is used, for example, in order to couple out a small portion of the laser beam and redirect it to a fast IR detector. The needle is a wear part, so the measuring device is only conditionally suitable for continuous use in the laser processing machine. [0003] An a...
Claims
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IPC IPC(8): B23K26/70G01K17/00G01J1/42
CPCB23K26/426G01J1/4257B23K26/705
Inventor W·舍利驰-特斯曼M-C·马丁斯
Owner TRUMPF WERKZEUGMASCHINEN GMBH & CO KG