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Method and equipment for manufacturing special circuit board

A manufacturing method and technology of circuit boards, which are applied in the fields of circuits, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problem of being unable to manufacture special circuit boards with odd-numbered circuit layers, and achieve the effect of avoiding bending

Inactive Publication Date: 2013-04-17
NEW FOUNDER HLDG DEV LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Embodiments of the present invention provide a method and equipment for manufacturing special circuit boards with odd layers, which are used to solve the problem that special circuit boards with odd-numbered circuit layers cannot be manufactured in the prior art

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  • Method and equipment for manufacturing special circuit board
  • Method and equipment for manufacturing special circuit board
  • Method and equipment for manufacturing special circuit board

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Embodiment Construction

[0050] In order to be able to manufacture special circuit boards with odd-numbered circuit layers, an embodiment of the present invention provides a method for manufacturing special circuit boards with odd-numbered layers. Specialty circuit boards with an odd number of wiring layers. Special circuit boards include any circuit boards such as IC packaging substrates. The following uses IC packaging substrates as an example.

[0051] see figure 1 , the method for manufacturing an odd-numbered-layer IC packaging substrate provided by an embodiment of the present invention specifically includes the following steps:

[0052] Step 10: Select a core board with conductive surface layer as the first bearing layer;

[0053] Step 11: making an initial layer on a conductive surface of the first carrying layer;

[0054] Step 12: making a first conductive layer on the visible conductive surface of the initial layer;

[0055] Step 13: Select another core board with conductive surface lay...

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PUM

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Abstract

An embodiment of the invention discloses a method for manufacturing an odd-layer special circuit board, which comprises the following steps of: fabricating a start layer on a conducting surface of a first bearing layer and fabricating a first conducting layer on the visible conducting surface of the start layer; laminating a second bearing layer with the first conducting layer; peeling the first bearing layer, fabricating a first line layer on another conducting surface of the start layer after peeling, and fabricating a second conducting layer on the first line layer; performing prepreg lamination on the first line layer and the second conducting layer; and peeling the second bearing layer and fabricating line layers respectively on the conducting surfaces where the first conducting layer and the second conducting layer are located after peeling as a second line layer and a third line layer, wherein the first bearing layer and the second bearing layer are core boards, surface layers of which have conducting performance. The embodiment of the invention further discloses a method and equipment for manufacturing an even-layer special circuit board. By the invention, the manufacturing of the arbitrary-layer special circuit board is realized.

Description

technical field [0001] The invention relates to the field of base circuit board manufacturing, in particular to a method and equipment for manufacturing a special circuit board. Background technique [0002] Traditional IC packaging uses a lead frame as a carrier for the IC conduction line and supports the IC, and it connects pins on both sides or around the lead frame. With the development of IC packaging technology, the number of pins has increased (more than 300 pins), and traditional packaging forms such as QFP have limited their development. In this way, in the mid-1990s, a new type of IC packaging represented by BGA and CSP came out, and a necessary new carrier for semiconductor chip packaging was also produced. This is the IC packaging substrate, also known as IC packaging. board (substrate). IC packaging substrate is used in semiconductor chip packaging to realize the supporting function of interconnection and installation of bare chips or packaged chips. At the sa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/498
CPCH01L2924/0002
Inventor 苏新虹
Owner NEW FOUNDER HLDG DEV LLC