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Screen printing device, paste material feeding method and manufacturing method of printing object

A technology of screen printing device and object, which is applied in the direction of screen printing machine, printing machine, printing machine, etc., can solve the problems of time consumption, rolling diameter and length deviation, uneven development, etc., and achieve the effect of realizing efficiency

Active Publication Date: 2015-01-21
JUKI AUTOMATION SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the solder printing machine of Patent Document 1, the solder supplied from the tube is rolled by the squeegee, and it takes time to expand to the same length as the width of the substrate (the width in the direction perpendicular to the movement direction of the squeegee) of the object to be printed.
For example, this problem becomes more prominent when the substrate area is increased
[0005] Also, when a large amount of solder is supplied at once from the tube of the above-mentioned solder supply device, the solder spreads unevenly in the longitudinal direction of the scraper, and the rolled diameter of the solder varies in its longitudinal direction.

Method used

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  • Screen printing device, paste material feeding method and manufacturing method of printing object
  • Screen printing device, paste material feeding method and manufacturing method of printing object
  • Screen printing device, paste material feeding method and manufacturing method of printing object

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Embodiment approach

[0112] Embodiments described in the present invention are not limited to the embodiments described above, and there are various other embodiments.

[0113] In the above-described embodiment, the solder paste is alternately supplied to the regions A and B sequentially. However, for example, when it is supplied for the Nth time, it is area A, when it is supplied for N+1 time, it is area A, when it is supplied for N+2 times, it is area B, and when it is supplied for N+4 times, it is area A..., according to In this way, A→A→B→A→A→B→..., this supply method is also possible. At this time, the amounts of solder paste respectively supplied to the regions A and B are substantially constant.

[0114] Alternatively, for example, the frequency or order of supplying the solder paste to the supply region may be set in accordance with the pattern to be printed on the circuit board W. For example, as mentioned above, area A→A→B→A→A→B→..., this supply method is suitable for the total number ...

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Abstract

The invention provides a screen printing device which can realize the efficiency for process time and can form a paste material with a uniform rolling diameter in the length direction of a scraper during a paste material coating process, a paste material feeding method and a manufacturing method of a printing object. In the embodiment, solder pastes are not fed continuously to two regions A and B, are fed to the region A in the Nth feeding and are fed to the region B in the N+1th feeding. The efficiency for process time can be realized by alternately feeding solder pastes to different regions A and B at different time, and a solder paste with a uniform rolling diameter can be formed in the length direction of the scraper during the paste material coating process.

Description

technical field [0001] The present invention relates to a screen printing device for printing paste such as solder paste on an object to be printed, a method for supplying the paste, and a method for manufacturing the object to be printed. Background technique [0002] In the screen printing apparatus, a substrate is placed under a screen (mask) with a plurality of holes formed therein, a paste is applied to the screen, and the paste is selectively supplied to the substrate through the holes. In this way, the paste is printed on the substrate with various printing patterns. [0003] For example, the solder printing machine described in Patent Document 1 includes, for example, as shown in FIG. 18 , a solder supply device for supplying solder paste and a scraper provided under the solder supply device. The scraper is provided to be movable, and has a long shape in a direction perpendicular to the moving direction thereof. The solder paste is supplied between the two squeegee...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41F15/08B41F15/42B41F15/14
Inventor 渡边昭彦藤井雅治
Owner JUKI AUTOMATION SYST