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Tactile wafer lifter and methods for operating the same

A wafer, tactile technology, applied in lifting devices, semiconductor/solid state device manufacturing, lifting equipment safety devices, etc., can solve problems such as expensive, wafer lifting equipment chip damage, etc.

Inactive Publication Date: 2011-09-28
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It should be understood that such disturbances or collisions may result in damage to the wafer lifter, components involved in the collision, and / or the wafer itself (if present on the wafer lifter or components at the time of the collision)
As expected, said damage was very costly in terms of product loss and system downtime

Method used

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  • Tactile wafer lifter and methods for operating the same
  • Tactile wafer lifter and methods for operating the same
  • Tactile wafer lifter and methods for operating the same

Examples

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Embodiment Construction

[0008] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be understood, however, to one of ordinary skill in the art, that the present invention may be practiced without some or all of these specific details. In other instances, well known process operations have not been described in detail in order not to unnecessarily obscure the present invention.

[0009] Figure 1A A wafer wet processing chamber 115 incorporating a wafer handling system as described herein is shown in accordance with one embodiment of the present invention. The process chamber 115 is bounded by outer walls comprising substantially parallel side walls 113A and 113B. The drive rail 109 is connected to the side wall 113A in a substantially horizontal direction. The guide rail 111 is connected to the side wall 113A in a substantially horizontal direction. Wafer carrier 101 is arranged in a substantially hori...

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PUM

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Abstract

A tactile wafer lifting apparatus includes a pedestal and a vertical drive connected to the pedestal. The vertical drive is defined to provide controlled upward and downward movement of the pedestal. The tactile wafer lifting apparatus also includes a wafer support member disposed over the pedestal. A tactile switch is disposed between the wafer support member and the pedestal such that sufficient downward force on the wafer support member causes activation of the tactile switch. The tactile switch is connected to the vertical drive so as to interrupt upward movement of the pedestal and wafer support member disposed thereover upon activation of the tactile switch.

Description

Background technique [0001] In fabricating semiconductor devices (eg, integrated circuits, memory cells, etc.), a series of fabrication operations are performed to define features on a semiconductor wafer ("wafer" or "substrate"). The wafer includes integrated circuit devices defined in a multi-level structure on a silicon substrate. At the substrate level, transistor devices are formed with diffusion regions. At subsequent levels, interconnecting metal lines are patterned and electrically connected to transistor devices to define the desired integrated circuit devices. Also, the patterned conductive layer is isolated from other conductive layers by a dielectric material. [0002] Various wafer fabrication operations require shipping and moving wafers. For example, some manufacturing operations require that a wafer be moved vertically at a specific location, and lift equipment is used to provide the vertical movement of the wafer. A basic wafer lifter may be defined to onl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/683H01L21/687
CPCB66F17/00B23P11/00H01L21/68742H01L21/67742H01L21/6835H01L21/68714H01L21/68785Y10T29/49826
Inventor 凯斯·E·道森戴夫·埃文斯
Owner LAM RES CORP