Lifting and pressing mechanism applied to wafer polishing equipment

A technology of pressurizing mechanism and lifting mechanism, which is used in surface polishing machine tools, grinding/polishing equipment, metal processing equipment, etc. , the inertia is small, the effect of improving the pressure control accuracy

Inactive Publication Date: 2011-11-02
THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional lifting and pressurizing mechanism uses one cylinder to complete all the above tasks, because the cylinder selected by this mechanism must not only realize the pressurization function but also meet the requirements of the lifting stroke, so it has low pressurization accuracy, large overall volume, and large impact , difficulty in control, etc.

Method used

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  • Lifting and pressing mechanism applied to wafer polishing equipment
  • Lifting and pressing mechanism applied to wafer polishing equipment
  • Lifting and pressing mechanism applied to wafer polishing equipment

Examples

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Embodiment Construction

[0019] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments, but they are not intended to limit the present invention.

[0020] as attached figure 1 , 2 The embodiment of the present invention shown in . 3 includes a carrier 9, a frame, and a lifting mechanism and a pressurizing mechanism that are connected to the carrier 9 and can respectively control the pressurizing and lifting actions of the carrier 9, which are arranged on the frame.

[0021] The frame described in this embodiment is composed of a bottom plate 10, a side plate 11 and a top plate 20, and this frame plays the role of fixing, supporting and positioning reference for the whole mechanism.

[0022] The pressurizing mechanism includes a pressurizing cylinder 1, a spline shaft 6, and a connecting piece. The cylinder 1 is connected, the lower part of the spline shaft 6 passes through the frame bottom plate 10 to connect the carrier 9, the spline sl...

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PUM

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Abstract

The invention relates to a lifting and pressing mechanism applied to wafer polishing equipment, which can separate lifting motion and pressure loading motion from each other in a polishing process of a polishing head. The lifting and pressing mechanism applied to the wafer polishing equipment comprises a bearer, a frame, and a lifting mechanism and a pressing mechanism, wherein the lifting mechanism and the pressing mechanism are arranged on the frame and are connected with the bearer for controlling a pressing action and a lifting action of the bearer respectively. Through the lifting and pressing mechanism, a lifting function and a pressing function on a polishing machine can be separately performed; and the requirements for reducing the impact of the mechanism to a pressing process, improving control accuracy of wafer polishing pressure and control sensitivity and the like are also met while the requirement of a lifting travel is met.

Description

technical field [0001] The invention relates to a lifting and pressing mechanism applied to wafer polishing equipment, which can separate the lifting movement and the pressure loading movement of the polishing head during the polishing process. Background technique [0002] During the chemical mechanical polishing process of the wafer, the polishing head carrying the wafer should not only complete the lifting function, but also complete the polishing pressure loading function during the polishing process. The traditional lifting and pressurizing mechanism uses one cylinder to complete all the above tasks, because the cylinder selected by this mechanism must not only realize the pressurization function but also meet the requirements of the lifting stroke, so it has low pressurization accuracy, large overall volume, and large impact , difficult to control and other issues. Contents of the invention [0003] The purpose of the present invention is to provide a lift and press...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/00
Inventor 费玖海高慧莹孙振杰
Owner THE 45TH RES INST OF CETC
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