Substrate electroplating clamp with covered rubber on surface

Abstract

The invention discloses a substrate electroplating clamp with covered rubber on the surface. The substrate electroplating clamp comprises two clamp bodies; the opposite positions at the clamp ends of the clamp bodies are respectively provided with a protruding contact, and the protruding contacts are opposite to each other; a first PVC (Poly Vinyl Chloride) coating layer with hardness range of 30-80 degrees covers on the non-opposite sides of the contacts and extends to parts of the clamping ends of the clamp bodies; a second PVC coating layer with hardness range of 80-110 degrees covers on the clamping ends of the clamp bodies; the first coating layer extends to the clamping end parts of the clamp bodies and is covered by the second coating layer; and the first coating layer is 0.1-0.8 mm longer than the opposite sides of the contacts. According to the substrate electroplating clamp with the covered rubber on surface disclosed by the invention, the problem that an electroplating solution easily damages the electroplating clamp at the adhesive jointing position; and while the substrate is clamped, a good conductive effect of the contacts can be guaranteed, and the contacts are sealed well and used for isolating the electroplating solution.

Description

technical field [0001] The invention relates to an important component base plate electroplating clip in a fully automatic vertical continuous electroplating equipment (VCPS). Background technique [0002] In the process of completing the plating of the substrate with the fully automatic vertical continuous plating equipment, the substrate needs to be clamped with a plating clamp and immersed in the plating solution. The substrate is connected to the negative electrode of the power supply through the electroplating clip, and the electroplating liquid is connected to the positive electrode. The metal ions in the electroplating solution move to the substrate and attach to the substrate, so as to achieve the purpose of electroplating metal on the substrate. [0003] Because the electroplating clip needs to have the function of conducting current, it is usually made of stainless steel SUS304. During the electroplating process, the electroplating clip will be partially immersed...

AI Technical Summary

Problems solved by technology

[0012] The technical problem to be solved by the present invention is: to provide an electroplating clip with glue coating on the surface. Using the electroplating clip can solve the problem that in the prior art, the electroplating solution is easily leaked from the glue joint or due to poor sealing between the cladding layer and the substrate. Problems that damage plated clips

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