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Systems and methods for aligning multiple layers of a device

A misalignment, board layer technology, applied in the direction of multi-layer circuit manufacturing, etc., can solve problems such as misalignment and plate deformation

Active Publication Date: 2011-12-21
CIMS HONG KONG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Ideally, the targets are aligned with each other, but actual slabs are distorted during manufacturing
Deformation may be different for different slabs, so targets calculated based on an ideal non-deformable manufacturing process may result in misalignment

Method used

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  • Systems and methods for aligning multiple layers of a device
  • Systems and methods for aligning multiple layers of a device
  • Systems and methods for aligning multiple layers of a device

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Experimental program
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Embodiment Construction

[0038] Since the apparatus for implementing the invention is largely formed from electronic components and circuits known to those skilled in the art, no unnecessary details of the circuits will be described in order to understand the basic principles of the invention and not to obscure or divert the teachings of the invention. Explain more.

[0039] In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, and components have not been described in detail so as not to obscure the present invention.

[0040] The proposed method and system can provide better alignment between layers during the lamination process, can improve the yield of the lamination process and the PCB manufacturing process, and can f...

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PUM

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Abstract

The present invention relates to systems and methods for aligning multiple layers of a device. A system and method for aligning layers of a printed circuit board (PCB) is provided, the method comprising: calculating, for each layer in a set of layers of the PCB, each critical area in the layer's critical area group The deformation factor of , the calculation is based on the deviation of the point of interest of the key area from the expected position of the point of interest; the rotation angle of each key area in the key area group is calculated for each layer in the layer set of PCB; based on Deformation factors and rotation angles for key areas in key area groups for each layer, calculating for each layer desired locations for a plurality of holes for that layer; punching holes at the desired locations to provide punched holes; using the punched aligning the plurality of layers of the PCB through holes; and connecting the plurality of layers of the PCB to each other to provide a PCB.

Description

[0001] related application [0002] This application claims priority to US Provisional Patent Application Serial No. 61 / 354,730, filed June 15, 2010, which is hereby incorporated in its entirety. technical field [0003] The present invention relates to systems and methods for aligning multiple layers of a device. Background technique [0004] A printed circuit board (PCB) comprises several layers, which are manufactured independently of each other and then laminated together. The lamination process involves aligning the different layers by inserting components into holes drilled in each layer. [0005] In order to get a good connection between all layers, these layers and all critical areas (such as pads, dense lines and traces) should be located precisely on top of each other. [0006] Today, the most common solution is to define a small number of targeted holes on the edge of the panel and fasten each layer to dowels. The holes are produced by a punching machine. [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
Inventor R·波拉特S·佩雷斯
Owner CIMS HONG KONG CO LTD