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grinding tool

A grinding process and tool technology, applied in the manufacture of tools, metal processing equipment, grinding/polishing equipment, etc., can solve the problems of troublesome management, high cost of grinding wheels, large number of grinding wheels, etc., and achieve the effect of reducing burden and cost

Active Publication Date: 2015-09-09
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, for the above-mentioned grinding wheel, it is necessary to prepare such a grinding wheel: the form (shape, length, forming position, etc.) shape, etc.) to meet various grinding conditions, there is a problem that the number of grinding wheels is large and management is troublesome
In addition, although the part consumed by use is only the grinding wheel, since the entire grinding wheel including the base part is disposed of as a consumable, the cost of the grinding wheel is high

Method used

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Embodiment Construction

[0020] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0021] (1) Grinding device

[0022] according to figure 1 , a grinding apparatus to which a grinding wheel (grinding tool) according to an embodiment is applied will be described. This grinding device 10 is a device as follows: for example, a disk-shaped semiconductor wafer with a thickness of about 700 μm is used as a workpiece, and such a workpiece is horizontally held on a chuck table 20 of a vacuum chuck type, and The surface to be processed of the workpiece is exposed upward, and the surface to be processed is ground by the grinding member 30 to process the workpiece to a predetermined thickness.

[0023] The grinding device 10 has a rectangular parallelepiped device base 11 long in the X direction. On the device base 11, a rectangular table base (Ta brubes) 25 is provided so as to be movable in the X direction. The above-mentioned chuck table 20 is supported...

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Abstract

PROBLEM TO BE SOLVED: To provide a grinding tool which can reduce load of maintenance and cost. SOLUTION: A base section 40 on which several grinding stones 419 are arranged and a nozzle 422 for supplying grinding liquid is formed is composed of a first section 41 where the grinding stones 419 are arranged and a second section 42 which is separable from the first section 41 and the nozzle 422 is formed. Only the first section 41 where expendable grinding stones 419 are arranged is handled as an expendable item, and the second section 42 where the nozzle 422 is formed can be used without being replaced.

Description

technical field [0001] The present invention relates to a grinding tool provided in a grinding device for grinding a plate-shaped object such as a semiconductor wafer. Background technique [0002] A grinding apparatus for grinding a plate-shaped workpiece such as a semiconductor wafer includes a grinding member for grinding a plate-shaped object held by suction on a chuck table. As such a grinding member, a grinding member composed of the following components is known: a main shaft, which is rotatably arranged and extends in a vertical direction; a wheel base, which is attached to the lower end of the main shaft; And a grinding wheel (grinding tool) which is detachably attached to a wheel base (refer patent document 1). [0003] The grinding wheel disclosed in the aforementioned Patent Document 1 is composed of an annular base portion and a grindstone fixed to the lower surface of the base portion. Moreover, a plurality of nozzles (through holes for spraying grinding flui...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B19/22H01L21/304
CPCH01L21/304H01L21/67092
Inventor 长井修桑名一孝星川裕俊早坂秀树
Owner DISCO CORP