computer case

一种壳体、电脑的技术，应用在电数字数据处理、数字处理电源分配、仪器等方向，能够解决温度上升、死机、发热量上升等问题
CN102298424AInactive Publication Date: 2011-12-28HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
Publication Date
2011-12-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

A computer housing, comprising a base plate and a rear plate, a main board is installed on the base plate, an expansion card is extended and connected to the main board, a power supply is installed on the rear plate, the rear plate An opening is opened on the top, the power supply includes a wider fan installation part and a narrower power supply installation part, a fan is installed in the fan installation part, and the fan installation part includes opposite rear walls and A first front wall, a number of openings are opened on the back wall, a number of first ventilation holes are opened on the first front wall, and the power supply installation part includes a second side perpendicular to the first front wall wall, the first front wall protrudes from the second side wall, the rear wall is installed in the opening, and the second side wall is opposite to the expansion card to form a wind between them. The first front wall is located in the air channel, and the fan can drive airflow to flow through the air channel to dissipate heat for the expansion card.
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Description

technical field

[0001] The invention relates to a computer casing, especially a computer casing with good heat dissipation performance. Background technique

[0002] With the advancement of technology, the operating frequency of the central processing unit, graphics card chip and other chips in the computer continues to increase, and its power is also increasing. For example, the current popular dual-core central processing unit has a power of more than 100 watts. The power of the chip has already exceeded 100 watts. The increase in the power of these components has directly led to a linear increase in the heat generation. On the other hand, the chassis in which these components are installed is developing in the direction of miniaturization. If the heat dissipation performance of the chassis is not good, the heat inside the chassis will continue to increase and the temperature will rise, which will eventually lead to serious consequences such as a decrease in the stability ...

Claims

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