computer case

一种壳体、电脑的技术，应用在电数字数据处理、数字处理电源分配、仪器等方向，能够解决温度上升、死机、发热量上升等问题

Inactive Publication Date: 2011-12-28
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the advancement of technology, the operating frequency of the central processing unit, graphics card chip and other chips in the computer continues to increase, and its power is also increasing. For example, the current popular dual-core central processing unit has a power of more than 100 watts. The power of the chip has already exceeded 100 watts. The increase in the power of these components has directly led to a linear increase in the heat generation. On the other hand, the chassis in which these components are installed is developing in the direction of miniaturization. If the heat dissipation performance of the chassis is not good, the heat inside the chassis will continue to increase and the temperature will rise, which will eventually lead to serious consequences such as a decrease in the stability of the computer, crashes, and even hardware burns.

Method used

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Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0011] see figure 1 An embodiment of the computer case of the present invention includes a casing 20 and several components that can be fixed in the casing 20 , and these components include a computer motherboard 30 and a power supply 40 .

[0012] The casing 20 includes a base plate 21, a rear plate 23 and a side plate 25, the rear plate 23 and the side plate 25 are formed by extending from adjacent two edges of the base plate 21, and are perpendicular to the base plate 21, the rear plate 23 and the The side panels 25 are perpendicular to each other, and the rear panel 23 defines a square opening 231 adjacent to the side panels 25 .

[0013] The main board 30 is fixed on the base plate 21, an edge 31 of the main board 30 is aligned with the rear board 23, the length of the edge 31 is less than the length of the rear board 23, and the position of the opening 231 adjacent to the side plate 25 is not opposite to the main board 30, the main board 30 Some expansion card slots 32 ...

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PUM

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Abstract

A computer housing, comprising a base plate and a rear plate, a main board is installed on the base plate, an expansion card is extended and connected to the main board, a power supply is installed on the rear plate, the rear plate An opening is opened on the top, the power supply includes a wider fan installation part and a narrower power supply installation part, a fan is installed in the fan installation part, and the fan installation part includes opposite rear walls and A first front wall, a number of openings are opened on the back wall, a number of first ventilation holes are opened on the first front wall, and the power supply installation part includes a second side perpendicular to the first front wall wall, the first front wall protrudes from the second side wall, the rear wall is installed in the opening, and the second side wall is opposite to the expansion card to form a wind between them. The first front wall is located in the air channel, and the fan can drive airflow to flow through the air channel to dissipate heat for the expansion card.

Description

technical field [0001] The invention relates to a computer casing, especially a computer casing with good heat dissipation performance. Background technique [0002] With the advancement of technology, the operating frequency of the central processing unit, graphics card chip and other chips in the computer continues to increase, and its power is also increasing. For example, the current popular dual-core central processing unit has a power of more than 100 watts. The power of the chip has already exceeded 100 watts. The increase in the power of these components has directly led to a linear increase in the heat generation. On the other hand, the chassis in which these components are installed is developing in the direction of miniaturization. If the heat dissipation performance of the chassis is not good, the heat inside the chassis will continue to increase and the temperature will rise, which will eventually lead to serious consequences such as a decrease in the stability ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/188G06F1/20
Inventor 孙洪智陈琛李阳
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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