Semiconductor device
A semiconductor and conductive technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as component damage and achieve the effect of suppressing component damage
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no. 1 approach
[0016] For the first implementation, use figure 1 to explain. figure 1 is a schematic diagram of important parts of the semiconductor device 100 according to the first embodiment, figure 1 (a) is a cross-sectional view of an important part of the semiconductor device 100 . figure 1 (b) is a plan view of an important part of the semiconductor device, and the cross-sectional view of A-A in the figure is 1(a). figure 1 (c) is figure 1 (b) Cross-sectional view of B-B. exist figure 1 In the plan view of (b), one direction from the center toward the end of the semiconductor device 100 is defined as the X direction (second direction), and the direction perpendicular thereto is defined as the Y direction (first direction). The same applies to the following embodiments.
[0017] Such as figure 1 As shown, the semiconductor device 100 includes first to fourth semiconductor layers. When viewed from above, it includes: an element region formed by a gate electrode disposed in a firs...
no. 2 approach
[0050] use figure 2 The semiconductor device 200 according to the second embodiment will be described. figure 2 is a schematic diagram of important parts of the semiconductor device 200 according to the second embodiment, figure 2 (a) is a cross-sectional view of an important part of the semiconductor device 200 . figure 2 (b) is a top view of an important part of the semiconductor device, and the cross-sectional view of line C-C in the figure is figure 2 (a). In addition, the same reference numerals or symbols are used for components having the same configuration as those described in the first embodiment, and description thereof will be omitted. Differences from the first embodiment will be mainly described.
[0051] In the semiconductor device 200 according to the second embodiment, as in the first embodiment, the second opening 15 is formed of a plurality of divisions spaced apart along the Y direction. However, in the present embodiment, the second opening 15 do...
no. 3 approach
[0054] use image 3 Next, a semiconductor device 300 according to the third embodiment will be described. image 3 is a schematic diagram of important parts of the semiconductor device 300 according to the third embodiment, image 3 (a) is a cross-sectional view of important parts of the semiconductor device 300 . image 3 (b) is a plan view of an important part of the semiconductor device, and the cross-sectional view taken along line D-D in the figure is 3(a). In addition, the same reference numerals or symbols are used for components having the same configuration as those described in the first embodiment, and description thereof will be omitted. Differences from the first embodiment will be mainly described.
[0055] In the semiconductor device 300 according to the third embodiment, like the semiconductor device 100 according to the first embodiment, the distance between the second opening 15 and the second trench 6 in the X direction alternately has a wider part and a ...
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