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Thermocouples with two tabs spaced apart along a transverse axis and methods

A thermocouple, lateral technology, applied in the field of temperature devices, can solve the problems of inaccurate temperature readings, complicated use of thermocouples, etc.

Inactive Publication Date: 2014-08-20
CORNING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The 4°C to 5°C signal noise can lead to inaccurate temperature readings of the substrate, complicating the use of thermocouples for monitoring or control capabilities

Method used

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  • Thermocouples with two tabs spaced apart along a transverse axis and methods
  • Thermocouples with two tabs spaced apart along a transverse axis and methods
  • Thermocouples with two tabs spaced apart along a transverse axis and methods

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Embodiment Construction

[0017] Hereinafter, the embodiments will be described more fully with reference to the accompanying drawings in which example embodiments are shown. Whenever possible, the same reference numbers are used in the drawings to indicate the same or similar parts. However, the various aspects can be implemented in many different forms, and should not be construed as being limited to the embodiments described herein.

[0018] Various aspects of the present disclosure can be used with devices that include thermocouples and substrates mentioned in Adelsberg et al. U.S. Patent Application No. 2008 / 0175304, which is hereby incorporated by reference in its entirety. Include this article. figure 2 A schematic arrangement of the thermocouple 201 according to various aspects of the present disclosure is shown. The thermocouple 201 includes a first joint element 203 and a second joint element 205 attached to a conductive substrate 207. The conductive substrate 207 may be operatively connected ...

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Abstract

Methods for determining a temperature of a portion of an electrically conductive substrate are provided wherein the substrate is heated by applying an electrical current flow through the substrate. The method for determining the temperature employs a thermocouple including a first tab element and a second tab element that are spaced apart from one another along an axis transverse to a direction of the current flow. In another example, an apparatus includes an electrically conductive substrate and a direct heating apparatus configured to heat the substrate with an electrical current flow through the substrate. The apparatus includes first and second coupling positions of a thermocouple that are spaced apart from one another along an axis transverse to a direction of the current flow.

Description

[0001] Pursuant to Section 119 of Title 35 of the United States Code, this application requires the priority benefit of the US provisional application serial number 61 / 407669 filed on October 28, 2010; and, pursuant to Section 120 of Title 35 of the United States Code, this application The application claims the priority benefit of the U.S. application with serial number 13 / 106237 filed on May 12, 2011; this application relies on the content of the two applications, and the two applications are incorporated by reference in their entirety This article. Technical field [0002] The field relates generally to thermocouples, and more specifically to devices and methods for determining the temperature of a portion of a conductive substrate. Background technique [0003] For various applications, it is desirable to use a thermocouple to measure the temperature of a directly heated device. US Patent Application Publication No. 2008 / 0175304 by Adelsberg et al. (hereinafter referred to as...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K7/04
CPCG01K7/04G01K7/02G01K7/14
Inventor D·R·布德罗K·P·欧利希D·D·莱依
Owner CORNING INC