Detachable liquid cooling heat dissipation module
A cooling module, detachable technology, applied in sustainable buildings, climate sustainability, instruments, etc., can solve the problems of large power consumption of cooling fans, single electronic parts, coolant leakage, etc., to avoid coolant leakage, The effect of eliminating pipeline disorder and reducing the number of
Inactive Publication Date: 2012-05-30
INVENTEC CORP
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Problems solved by technology
[0005] Although the above two heat dissipation methods can both achieve the effect of heat dissipation, the air-cooled heat dissipation mainly relies on the cooling fan, but the cooling fan will generate considerable noise during operation. If you want to improve the noise problem, it will cost a lot of money, so Air-cooled heat dissipation is limited to equipment cost and noise issues. In addition, the cooling fan consumes a lot of power when it is running
[0006] Water-cooled heat dissipation mainly uses coolant, but the devices currently used in water-cooled heat dissipation can only be used for a single electronic component. If there are multiple electronic components that need to be cooled, multiple sets of devices must be installed, which will cause problems for computers or servos. The internal pipeline of the device is disordered, and there is a great chance that it may cause the problem of coolant leakage
[0007] To sum up the above, the common air-cooled and water-cooled heat dissipation have the above-mentioned shortcomings respectively, so the existing heat dissipation methods or structures still have great room for improvement
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[0020] The implementation of the present invention is described below with reference to specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
[0021] see figure 1 and figure 2 As shown, the detachable liquid cooling module of the present invention has a first flow pipe 1 , a second flow pipe 2 , a plurality of heat conducting blocks 3 and a quick connector 4 .
[0022] The first flow pipe 1 has a first flow channel 10, the two sides of the first flow pipe 1 respectively have a plurality of outflow holes 11, the outflow holes 11 communicate with the first flow channel 10, one end of the first flow pipe 1 is connected with an inflow pipe 12, and the other There are two fixing holes 13 at one end, and there is a gap 14 at the bottom of the first flow pipe 1 . In addition, the inflow pipe 12 communicates with the first flow channel 10 .
[0023] The ...
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The invention relates to a detachable liquid cooling heat dissipation module which is provided with a first flow tube, a second flow tube and a plurality of heat conducting blocks, wherein the first low tube is arranged on the top end of the first flow tube; the bottom end of the second flow tube is provided with a clearance, so that a heat insulating structure is formed between the first flow tube and the second flow tube; and the heat conducting blocks are arranged on both sides of the first flow tube and the second flow tube. In such a structure combining the first flow tube, the second flow tube and the heat conducting blocks, the invention provides a modularized heat dissipation structure, and can achieve the effects of heat dissipation and energy saving.
Description
technical field [0001] The invention relates to a detachable liquid cooling and heat dissipation module, which provides a modular structure formed by combining multiple heat conduction blocks and pipelines, so as to eliminate the disordered state of pipelines and achieve the effects of heat dissipation and energy saving. Background technique [0002] For a long time, computer heat dissipation has been an important issue, especially for servers. Common heat dissipation methods can be divided into two types: air-cooled and water-cooled. [0003] Air-cooled heat dissipation: Paste the cooling fins on the electronic parts to be dissipated, such as the central processing unit or memory, the heat generated by the electronic parts will be conducted to the cooling fins, and then the heat will be blown away by the cooling fan into the air for heat dissipation. [0004] Water-cooled heat dissipation: attach a heat conduction block to the electronic parts that want to dissipate heat. ...
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IPC IPC(8): G06F1/20
CPCY02B60/1275Y02D10/00
Inventor 陈建安陈怡玲
Owner INVENTEC CORP