Method for determining optimal curing condition of silver paste

A technology of curing conditions and silver paste, applied in the field of determining the best curing conditions of silver paste, can solve the problems of device bottom shedding, lack, delamination, etc., and achieve the effect of clear and concise process, stable curing temperature and strong operability
CN102507644BActive Publication Date: 2014-06-25波达通信设备(广州)有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
波达通信设备(广州)有限公司
Publication Date
2014-06-25

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Abstract

The invention discloses a method for determining the optimal curing condition of silver paste, which comprises the following steps of: (1), dispersing the silver paste on a bonding pad; (2), carrying out surface mounting of short circuit blocks at corresponding silver paste positions; (3), fixing a temperature sensing line on a microwave plate; (4), acquiring and recording the temperature variation of the temperature sensing line by a data acquisition device; (5), opening an oven door to dissipate heat and cool, and when the temperature is reduced to about 50 DEG C, stopping temperature recording to obtain a temperature variation curve graph of five points in the whole process; (6), according to the obtained temperature variation curve graph, determining whether a preset condition is the optimal condition; and (7) if the effect is not ideal, returning to the step (1) to determine the curing condition of the silver paste again. In the method, according to information of the silver paste in the curing process, the curing condition of the silver paste is determined by combining the data acquisition device; the whole process is clear and simple; and the curing condition of the silver paste can be accurately determined.
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Description

technical field

[0001] The invention relates to the field of polymer coatings and materials, in particular to a method for determining the optimum curing conditions of silver paste. Background technique

[0002] The composition of silver paste is silver epoxy resin, which is currently widely used in the bonding process of small and medium-sized electronic components that have special requirements for conductivity and electronic interference. However, the curing requirements of silver paste are relatively high, and the conductive silver paste is different due to different substrates. The drying conditions are also different. The traditional baking of conductive silver paste is a hot air oven. At the same time, in order to ensure that the printed products are completely dried in the drying room and the electrical performance is qualified, circulating hot air is necessary. In practical application, when silver paste is placed on the aluminum substrate, the curing conditions are...

Claims

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