Ball attachment device, solder ball picking method and solder ball mounting method
A technology of solder balls and ball planting, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of uncontrollable number of solder balls, prevent the loss of solder balls, prevent waste, and improve reliability and efficiency Effect
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[0025] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Embodiments may, however, be embodied in many different forms and should not be limited to the examples set forth herein. Rather, these examples are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the embodiments to those skilled in the art. In the drawings, the size and relative sizes of layers and regions are exaggerated for clarity. In the drawings, the same reference numerals denote the same elements throughout.
[0026] figure 1 is a sectional view showing a ball planting device according to an embodiment of the present invention. Such as figure 1 As shown in , the ball planting device according to the embodiment of the present invention may include a printing chamber 1 and a vacuum picker 2 .
[0027] The printing chamber 1 comprises a grid template 11 , side walls 12 , a top wall 13 and a doctor blade 15 . The ...
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