3D measuring device

A technology for three-dimensional measurement and measurement of objects, which is applied to measurement devices, optical devices, and image data processing. It can solve problems such as difficulty in detecting measurement objects, and achieve the effect of solving halo or shadow problems.

Active Publication Date: 2016-12-14
JUKI AUTOMATION SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In 2D image analysis, it is difficult to detect defects (such as cracks and voids) in the height direction of the measurement object

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0061] The overall configuration of the three-dimensional measuring device 100 and the configuration of each unit

[0062] figure 1 is a diagram showing the three-dimensional measuring device 100 according to the first embodiment of the present invention. figure 2 is a diagram showing an example of a measurement object to be three-dimensionally measured by the three-dimensional measurement device 100 .

[0063] Such as figure 2 As shown, according to this embodiment, an example of a substrate 10 having a plurality of inspection regions 11 ( 11A to 11J ) will be described as an example of a measurement object to be three-dimensionally measured by the three-dimensional measurement apparatus 100 . For example, in the inspection area 11, solder is printed as the inspection object 12 (see Figure 7 and Figure 8 etc.). exist figure 2 In the example shown in , the substrate 10 has ten inspection zones 11 .

[0064] Such as figure 1 As shown, the three-dimensional measurin...

no. 2 approach

[0117] Next, a second embodiment of the present invention will be described. When describing the second embodiment, constituent elements having the same configurations and functions as those of the first embodiment described above will be assigned the same reference numerals, and descriptions thereof will not be repeated or simplified.

[0118] Figure 13 is a diagram showing a plurality of imaging areas 1 provided in a projectable area 2 according to the second embodiment. exist Figure 13 In the illustrated example, in the projectable area 2 , the first shot area 1C is set at a position of 0°, and the second shot area 1D is set at a position of 135°.

[0119] In the second embodiment, since the position of the second photographing area 1D is different from that of the first embodiment, the position of the photographing unit 30 (second photographing part 32) or the position of the opening 27 of the hood 26 is appropriately changed, To suit the location of the second shooti...

no. 3 approach

[0150] Next, a third embodiment of the present invention will be described. The third embodiment differs from the above-described embodiments in that the three-dimensional measuring apparatus 100 according to the third embodiment is switchable between a high-precision mode (first mode) and a high-speed mode (second mode).

[0151] The high-precision mode is a mode in which one inspection area 11 is imaged in a plurality of imaging areas by moving one inspection area 11 to positions of a plurality of imaging areas 1 . The high-speed mode is a mode for simultaneously imaging a plurality of imaging areas 1 by setting a plurality of inspection areas 11 in a plurality of imaging areas 1 at the same time.

[0152] Figure 20 is a diagram showing the arrangement of a plurality of shot areas 1 in a projectable area 2 according to the third embodiment. Such as Figure 20 As shown, in the third embodiment, five shooting areas 1E, 1F, 1G, 1H and 1I are set in the projectable area 2 . ...

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PUM

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Abstract

The invention provides a three-dimensional measurement device, comprising: a projection unit, which projects stripes to a projectable area, which is the peripheral area of ​​the intersection point on the measurement object when a perpendicular line is drawn to the measurement object; a photographing unit, which can A plurality of photographing areas in the projection area in which the measurement object projected with the stripes is photographed; and a control unit that executes a process of three-dimensional measurement of the measurement object based on the image photographed by the photographing unit.

Description

technical field [0001] The present invention relates to a three-dimensional measurement device capable of three-dimensional measurement of a measurement object using a phase shift method or the like. Background technique [0002] Hitherto, as a method of inspecting the quality of a measurement object such as a printed substrate, a method of analyzing an image obtained by photographing the measurement object and inspecting the quality of the measurement object has been used. In two-dimensional image analysis, it is difficult to detect defects (for example, cracks and voids) in the height direction of the measurement object. For this reason, a method of measuring the three-dimensional shape of a measurement object by three-dimensional image analysis and detecting the quality of the measurement object has recently been adopted. [0003] As a method of measuring the three-dimensional shape of a measurement object by image analysis, a phase shift method (time fringe analysis met...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/25
CPCG01B11/2527G06T2207/10016G06T2207/10152G06T2207/30141G06T7/521G06T7/55
Inventor 外丸匠
Owner JUKI AUTOMATION SYST
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