Ultrasonic machining device and machining method for diamond microporous wire-drawing die
An ultrasonic machining and diamond technology, which is applied in the field of ultrasonic machining devices, can solve the problems of broken needles, easy broken needles, and great difficulty
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[0042] In order to effectively solve the problem of frequent needle folding in the prior art when processing diamond micro-hole wire drawing dies, especially when processing diamond micro-hole wire drawing dies with an aperture ≤ 0.03 mm. The invention provides an ultrasonic machining device for aligning the machining center of the machining area by means of an observation / detection / correction system when grinding and polishing the diamond microhole wire drawing die.
[0043] Such as figure 1 The ultrasonic processing device shown includes a device base 1 , a rotating motor 2 fixedly installed above the device base 1 , a rotary table 3 and a device column 4 . The rotary motor 2 is connected to the rotary table 3 by belts or chains, and the rotary motor 2 is used to drive the rotary table 3 to rotate. The rotary table 3 is used to fix the diamond microhole wire drawing die (hereinafter referred to as the die) to be processed, and drive the die to rotate. A mold centering mech...
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