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Wafer and method of manufacturing package product

A package and wafer technology, which is applied to the manufacturing field of wafers and package products, can solve the problems of unbonded central part, non-performing package products, low bonding strength, etc., and achieves good efficiency, improved strength, and improved The effect of yield

Inactive Publication Date: 2012-09-19
SEIKO INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, there are concerns that a package product that does not have the desired performance is obtained, or that the bonding strength of the central portions is lower than that of the outer peripheral portions due to strain in the central portion, or that according to conditions that result in the central portions not engaging each other

Method used

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  • Wafer and method of manufacturing package product
  • Wafer and method of manufacturing package product
  • Wafer and method of manufacturing package product

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Experimental program
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Embodiment Construction

[0048] Next, embodiments of the present invention will be described based on the drawings.

[0049] In addition, in this embodiment, as a package including a base substrate and a lid substrate that are anodically bonded to each other in a stacked state with a cavity formed therebetween, and an active sheet mounted on a portion of the base substrate located in the cavity, articles, exemplifying piezoelectric vibrators.

[0050] (Piezo Vibrator)

[0051] figure 1 It is an external perspective view of the piezoelectric vibrator in this embodiment. in addition, figure 2 It is a diagram of the internal configuration of the piezoelectric vibrator, and is a diagram of the piezoelectric vibrating piece viewed from above with the lid substrate removed. in addition, image 3 is along figure 2 A cross-sectional view of the piezoelectric vibrator shown on line A-A, Figure 4 is along figure 2 A cross-sectional view of the piezoelectric vibrator of the line B-B shown. in addit...

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PUM

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Abstract

The invention is characterized in that a groove portion (22) is formed in a wafer (50) for a lid substrate along a plurality of imaginary straight lines (V1, V2) passing through a center (50a) in a diameter direction of the wafer (50) for the lid substrate and extending in the diameter direction; the groove portion (22) is divided into a plurality of groove portions in the diameter direction placed such that the groove portions (22) are not in contact with each other, so as to provide a wafer in which out-gas emitted between wafers during bonding of the wafers can be easily discharged to the outside and the bonded wafers can be favorably cut to improve the yields, and a method of manufacturing a package product using the wafer.

Description

technical field [0001] The present invention relates to methods of manufacturing wafers and packaged articles. Background technique [0002] In recent years, a package product including a base substrate and a lid substrate that are anodically bonded to each other in a laminated state with a cavity formed therebetween, and a function of mounting a portion of the base substrate located in the cavity has been widely used. film (action film). As such a package product, for example, a piezoelectric vibrator is known which is mounted on a mobile phone or a portable information terminal device and uses quartz (crystal) or the like as a time source, a timing source such as a control signal, a reference signal source, or the like. [0003] In addition, the package product was formed as follows. [0004] First, a wafer for a base substrate and a wafer for a lid substrate are set in an anodic bonding apparatus disposed in a vacuum chamber, and these wafers are laminated via a bonding...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02H03H9/10
CPCH03H9/0519H03H3/04H03H2003/0492H03H2003/026H03H9/1021H03H2003/0478H03H9/21H01L2224/16225
Inventor 川田保雄
Owner SEIKO INSTR INC