Temperature measuring apparatus and temperature measuring method
A technology for temperature measurement and light measurement, which can be used in measuring devices, measuring heat, radiation pyrometry, etc., and can solve the problem of not being able to measure temperature at the same time
Active Publication Date: 2014-08-06
TOKYO ELECTRON LTD
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[0006] In the temperature measurement technique in which the above-mentioned measurement light is switched by a multiplexer and supplied to a plurality of processing chambers so that the temperature of substrates, etc. light, so the temperature of substrates, etc. in multiple processing chambers cannot be measured at the same time
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[0019] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in this specification and drawings, the same code|symbol is attached|subjected to the structural element which has substantially the same functional structure, and repeated description is abbreviate|omitted.
[0020] figure 1 It is a figure which schematically shows the structure of the temperature measurement apparatus 100 of 1st Embodiment. exist figure 1 In , PC1 to PC6 represent the processing chambers of the plasma etching device. In addition, in figure 1 In , the diagrams of PC3 to PC6 are simplified compared with PC1 and PC2 in consideration of the diagram space, but PC3 to PC6 have the same structure as PC1 and PC2. In the present first embodiment, the temperature measurement device 100 measures the temperature of the central portion and the peripheral portion of the semiconductor wafer W placed on the mounting table 10 arranged in the above-menti...
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The invention provides a temperature measuring device and a temperature measuring method. It is possible to simultaneously measure the temperature of temperature measurement objects in a plurality of processing chambers. The temperature measuring device includes: a first light splitter for splitting light from a light source into a plurality of light for measurement; a plurality of second light splitters for splitting the light for measurement into light for measurement and reference light; the third light separation part, which is used to divide the measurement light into n measurement lights, that is, the first measurement light to the nth measurement light; the reference light reflection part, which is used to respectively reflect a plurality of reference lights; an optical path a length changing part for changing the optical path length of the reference light reflected from the reference light reflecting part; The measurement is performed with reference to interference between a plurality of reference lights reflected by the light reflecting member.
Description
technical field [0001] The invention relates to a temperature measuring device and a temperature measuring method. Background technique [0002] From the aspect of accurately controlling the shape and physical properties of films and holes formed on substrates processed by plasma processing equipment, such as semiconductor wafers and substrates for liquid crystal display devices, based on the results of various processes such as film formation and etching See, it is extremely important to accurately measure the temperature of semiconductor wafers and substrates for liquid crystal display devices. Therefore, conventionally, the temperature of a semiconductor wafer or a substrate for a liquid crystal display device has been measured by various methods such as a measurement method using a resistance thermometer or a fluorescent thermometer for measuring the temperature of the back surface of the substrate. [0003] In recent years, there has been known a temperature measuremen...
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IPC IPC(8): G01K11/00G01J5/00
CPCG01J5/0007G01J5/0821G01J5/0044G01K11/12G01J2005/583H01L22/00Y10T428/192
Inventor 松土龙夫舆水地盐
Owner TOKYO ELECTRON LTD