Substrate stacking structure

Abstract

The invention discloses a substrate stacking structure which comprises a first substrate buried with a first wafer, a second substrate buried with a second wafer, a plurality of welded pieces and a third wafer. The welded pieces are connected between the first substrate and the second substrate and conduct the first substrate and the second substrate. An accommodation space is formed by the surrounding of the first substrate, the second substrate and the welded pieces. The third wafer is arranged in the accommodation space and jointed with the end face of the first substrate, and the third wafer is in electrical connection with the first wafer and the second wafer through the first substrate. Therefore, the overall thickness of the structure can be reduced, and the first wafer buried in the first substrate and the second wafer buried in the second substrate can be tested respectively and independently.

Description

technical field [0001] The present invention relates to a stacking structure, in particular to a substrate stacking structure. Background technique [0002] With the rapid development of electronic products, integrated circuits have become an indispensable product in the information age, such as notebook computers, mobile phones, personal digital assistants, and digital cameras, etc., and traces of integrated circuits can be seen everywhere. [0003] As far as the chip package in electronic products is concerned, in order to meet the needs of multi-function and high-speed and high-frequency computing of electronic products, it is necessary to increase the number of active components, but at the same time must meet the design requirements of light, thin, short, and miniaturized size. . [0004] In response to the demand for accommodating a large number of electronic components in a limited construction space, there are currently many integrated circuit packaging types availa...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to overcome the defects in the prior art that the thickness of the stacked structure is not easy to reduce, and the chips in the upper structure are not easy to be independently tested on different platforms, and the metal wires are easy to break, etc., to provide a Substrate stacking structure, which embeds chips in different substrates to reduce the overall thickness, and allows the chips in the substrate to be independently tested on different platforms

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