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A grounding assembly for vacuum processing apparatus

A technology of vacuum processing chamber and ground potential, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, plasma, etc., and can solve problems such as uneven electrical contact

Active Publication Date: 2012-10-31
KLA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, because the base and pedestal are not perfectly flat, the pedestal will not completely conform to the pedestal, so electrical contact will be uneven and more likely to be limited to discrete points

Method used

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  • A grounding assembly for vacuum processing apparatus
  • A grounding assembly for vacuum processing apparatus
  • A grounding assembly for vacuum processing apparatus

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Embodiment Construction

[0020] Figure 4A is a schematic diagram illustrating the major elements of a plasma processing chamber 400 implementing an embodiment of the invention. Chamber 400 includes a chamber body substantially made of metal, such as aluminum, stainless steel, or the like. There is a pedestal 408 for supporting a holder 420 on which one or more substrates 402 are placed. Throughout the remainder of this description, the abbreviation "stand" will be used to denote various alternative elements such as removable bases, trays, substrate holders, and the like. The key point here is that the substrate is on the holder and the holder is on the pedestal and needs to be in electrical contact with it. Pedestal 408 may be connected to lift mechanism 435 so that it can be lowered for substrate loading through valve 415 and then raised to the illustrated position for processing. Ground is supplied to the pedestal by the lift mechanism 435 and / or by eg a conductive strap or strip 401, depending ...

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Abstract

Vacuum processing chambers having provisions for improved electrical contact to substrate carrier. Specific embodiments provide a plasma processing chamber having a pedestal for supporting the carrier, and a plurality of fixed posts and resilient contacts are distributed over the area of the pedestal. The fixed posts provide physical support for the carrier, while the resilient contacts provide reliable and repeatable multi-point electrical contact to the carrier.

Description

technical field [0001] The present invention relates to a vacuum processing apparatus, such as a plasma chamber, for etching or forming thin films on substrates or other workpieces. Background technique [0002] Processes in semiconductors, flat panel displays, solar panels, and more include processing in vacuum chambers. For example, vacuum chambers are used for plasma-enhanced chemical vapor deposition (PECVD), physical vapor deposition (PVD), plasma etching, and various processes for forming thin films on substrates (workpieces) and etching structures on substrates. other treatments. In such a chamber, various gases are flowed into the chamber through an injector or through a showerhead, and a plasma is ignited to etch or deposit a thin film on the substrate. In order to attract charged species in the plasma towards the substrate, a ground potential is applied to the substrate or to an electrode below the substrate. [0003] Figures 1A-1C is a schematic illustration o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32
CPCH01L21/67748H01L21/6875H01L21/68785C23C16/54C23C16/5096H01J37/32091C23C16/4586H01J37/32715H01L21/67754H01L21/67069H01J37/32082H01L21/683H05H1/46
Inventor C·L·史蒂文斯W·T·布洛尼甘
Owner KLA CORP
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