Super-high density power trench MOSFET
Patent Information
- Authority / Receiving Office
- CN ยท China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- VISHAY SILICONIX LLC
- Publication Date
- 2015-07-01
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
[0001] Cross References to Related Applications
[0002] This application claims priority to U.S. Provisional Application Serial No. 61 / 253,464, filed October 20, 2009, by Robert Q. Xu et al., entitled "Super-High Density Power Trench MOSFET with Recessed Gated and Trench Edge Termination" , the contents of which are hereby incorporated by reference. Background technique
[0003] For conventional trench metal-oxide-semiconductor field-effect transistors (MOSFETs), it is desirable to increase their trench packing density. However, as the trench fill density of conventional trench MOSFETs continues to increase, manufacturing such conventional trench MOSFETs becomes more difficult. For example, it becomes more challenging to print very narrow trenches using photolithography. Also, inserting material into the very narrow trenches becomes more difficult when assembling this type of conventional trench MOSFET. Furthermore, the proper arrangement of specific electrical contacts be...