Metal P-type semiconductor junction tetrode type thermoelectric converting, refrigerating and heating device

A cooling and heating device, thermoelectric conversion technology, applied to thermoelectric devices that only use the Peltier or Seebeck effect, etc., can solve problems that have not been seen

Inactive Publication Date: 2012-11-14
冯建明
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, there is no metal P-type semiconductor junction tetrode thermoelectric conversion and cooling and heating devi

Method used

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  • Metal P-type semiconductor junction tetrode type thermoelectric converting, refrigerating and heating device
  • Metal P-type semiconductor junction tetrode type thermoelectric converting, refrigerating and heating device
  • Metal P-type semiconductor junction tetrode type thermoelectric converting, refrigerating and heating device

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Experimental program
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Embodiment Construction

[0029] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0030] figure 1Among them, the right surface of the metal material plate 1 is in contact with the left surface of the P-type semiconductor plate 2, the right surface of the P-type semiconductor plate 2 is in contact with the left surface of the metal material plate 3, and the right surface of the metal material plate 3 is in contact with the left surface of the P-type semiconductor plate 2. The left surfaces of the P-type semiconductor plates 4 are in contact together.

[0031] figure 2 Among them, when the metal P-type semiconductor junction tetrode thermoelectric conversion and cooling and heating device is in the heat source, the potential in the metal material plate 3 is higher than the potential in the metal material plate 1, and the potential in the P-type semiconductor plate 4 higher than the potential in the P-type semiconductor plate...

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PUM

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Abstract

The invention discloses a metal P-type semiconductor junction tetrode thermoelectric converting, refrigerating and heating device, which is formed by being sequentially and mutually in contact with two metal material plates and two P-type semiconductor plates, wherein the right surface of a metal material plate 1 is in contact with the left surface of a P-type semiconductor plate 2, the right surface of the P-type semiconductor plate 2 is in contact with the left surface of the metal material plate 3, and the right surface of the metal material plate 3 is in contact with the left surface of the P-type semiconductor plate 4. A load is connected between the metal material plate 1 and the metal material plate 3 or between the P-type semiconductor plate 2 and the P-type semiconductor plate 4 so that the thermoelectric conversion can be realized, and a direct current power supply is connected between the metal material plate 1 and the metal material plate 3 or between the P-type semiconductor plate 2 and the P-type semiconductor plate 4 so that the refrigerating and heating operations can be realized.

Description

technical field [0001] The present invention relates to thermoelectric conversion and cooling and heating devices, and more specifically, the present invention relates to a metal P-type semiconductor junction tetrode thermoelectric tube composed of two metal material plates and two P-type semiconductor plates in sequential contact with each other. Conversion and heating and cooling units. Background technique [0002] At present, there is no metal P-type semiconductor junction tetrode thermoelectric conversion and cooling and heating device composed of two metal material plates and two P-type semiconductor plates in sequential contact with each other in the market. Contents of the invention [0003] The object of the present invention is to provide a thermoelectric conversion and cooling and heating device with simple structure, which can be used for thermoelectric conversion as well as refrigeration or heating. [0004] The technical scheme of the present invention is as...

Claims

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Application Information

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IPC IPC(8): H01L35/32
Inventor 冯建明
Owner 冯建明
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