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Circuit board with heat sink and method of fabricating the same

A technology of circuit boards and heat sinks, which is applied in the fields of printed circuit manufacturing, circuits, printed circuits, etc., can solve the problems of high manufacturing cost, and achieve the effects of low manufacturing cost, good heat dissipation effect, and low cost

Inactive Publication Date: 2012-12-05
李金连
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the manufacturing cost of circuit boards made of ceramic substrates is still too high

Method used

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  • Circuit board with heat sink and method of fabricating the same
  • Circuit board with heat sink and method of fabricating the same
  • Circuit board with heat sink and method of fabricating the same

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Embodiment Construction

[0028] The invention provides a circuit board with a radiator. In particular, unlike the prior art, the circuit board with the heat sink of the present invention has good heat dissipation effect and low manufacturing cost. The features, advantages and implementation feasibility of the present invention will be further described in detail through several preferred specific embodiments below.

[0029] Such as figure 1 and figure 2 As shown, the circuit board 1 of a preferred embodiment of the present invention includes a substrate 10 , a wire layer 12 and a ceramic layer 14 . The wire layer 12 is formed on the upper surface 102 of the substrate 10 and includes two contacts corresponding to an electronic component 2 , ie, a first contact 122 and a second contact 124 . Same as a typical circuit board, the wire layer 12 on the circuit board 1 is used for bonding multiple electronic components 2 . For the convenience of explanation, figure 1 Only one electronic component 2 is ...

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Abstract

The invention provides a circuit board with heat sink and a method of fabricating the same. The circuit board according to the invention includes a substrate, a lead layer and a ceramic layer. The lead layer is formed on an upper surface of the substrate, and includes two contact points corresponding to an electronic device. The ceramic layer is formed on the upper surface of the substrate, and particularly formed between such two contact points. The ceramic layer serves as a heat sink for the electronic device.

Description

technical field [0001] The present invention relates to a circuit board, in particular to a circuit board with a heat sink. Background technique [0002] Most electronic components generate heat during operation. If there is no good heat conduction and heat dissipation mechanism, these electronic components will reduce their own efficiency as the temperature rises, and even their service life will be shortened. Taking light emitting diodes (light emitting diodes, LEDs) as an example, the luminous efficiency of light emitting diodes has been increased to over 30 lm / W at present, and it is expected to increase to over 120 lm / W in the future. With the improvement of luminous efficiency, the problem of heat dissipation of light-emitting diodes is becoming more and more serious. When the LED current increases, the chip junction temperature (junction temperature, Tj) increases accordingly. When Tj is too high, the output efficiency and lifespan of the LED will decrease. [0003...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00H01L33/62H01L33/64
CPCH05K1/02H05K3/00H05K2201/10106H01L33/64H05K2201/0179H01L33/62H05K2201/017H05K1/0209
Inventor 李金连
Owner 李金连