Plasma generating device and method
A generation device and plasma technology, applied in the direction of plasma, etc., can solve the problems of poor plasma efficiency and uniformity, gas can not be completely evenly distributed, and poor etching uniformity, etc. Effect
Active Publication Date: 2015-01-28
SHANGHAI HUALI MICROELECTRONICS CORP
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Problems solved by technology
[0003] In the above-mentioned plasma generating device, when the gas enters the quartz tube 1, since the gas outlet 4 is rapidly enlarged relative to the gas inlet 3, the gas cannot be completely uniformly distributed in the quartz tube 1, and the same cross-section The electric field intensity at different positions is different, so the efficiency and uniformity of plasma generation are poor
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[0019] The plasma degumming device and method of the present invention will be further described in detail below.
[0020] The invention will now be described in more detail with reference to the accompanying drawings, in which preferred embodiments of the invention are shown, it being understood that those skilled in the art may modify the invention described herein and still achieve the advantageous effects of the invention. Therefore, the following description should be understood as the broad knowledge of those skilled in the art, but not as a limitation of the present invention.
[0021] In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions and constructions are not described in detail since they would obscure the invention with unnecessary detail. It should be appreciated that in the development of any actual embodiment, numerous implementation details must be worked out to achieve the ...
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The invention relates to the manufacturing field of semiconductor equipment and particularly relates to plasma generating device and method. The plasma generating device comprises a quartz tube and an inductance coil, wherein an air inlet and an air outlet are arranged at two ends of the quartz tube; the inductance coil is wound at the position of the outer side of the quartz tube, which is close to the air inlet; and the plasma generating device further comprises a flow guide cover which is arranged in the quartz tube and is used for enabling gas to flow adjacent to the inductance coil. According to the plasma generating device disclosed by the invention, the flow guide cover is arranged in the quartz tube so that the flow direction and the distribution condition of the gas are changed after the gas enters the quartz tube, the gas is closer to the inductance coil, the plasma generating efficiency is improved, and the gas can be uniformly distributed; and the electric field intensities of all part are closer and the concentration of the generated plasma is more uniform.
Description
technical field [0001] The invention relates to the field of semiconductor equipment manufacturing, in particular to a plasma generating device and method. Background technique [0002] At present, the plasma generating device in the plasma degumming equipment usually adopts inductive coupling to generate plasma, and its structure is as follows: figure 1 As shown, it includes: a quartz tube 1 and an inductance coil 2, the two ends of the quartz tube 1 are respectively provided with an air inlet 3 and an air outlet 4, and the inductance coil 2 is wound on the outside of the quartz tube 1 close to the inlet The part of the gas port 3, its working principle is that the inside of the quartz tube 1 is a vacuum reaction system, and the gas is introduced into the quartz tube 1 from the gas inlet 3, and under the action of a high-frequency electric field, the quartz tube A strong electromagnetic field is formed in the tube 1 to excite the gas in the vacuum reaction system to genera...
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IPC IPC(8): H05H1/46
Inventor 潘无忌张东海
Owner SHANGHAI HUALI MICROELECTRONICS CORP