Circuit substrate stacking machine

A circuit substrate and stacking machine technology, applied in stacking receiving devices, sending objects, thin material processing, etc., can solve problems such as difficult stacking, inability to adapt to modern production, and easy damage to circuit substrates.

Inactive Publication Date: 2013-03-13
WUXI MINGZHU TURBOCHARGER MFG
View PDF6 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Generally, the circuit board has only a very narrow area around the edge without lines, which cannot be touched during the transportation and stacking process. It is difficult to complete the stacking of the existing equipment, and it is only solved by manpower. Not only the labor intensity of the workers is high, but the work efficiency is low. , cannot adapt to the requirements of modern production, and is easy to damage the circuit substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit substrate stacking machine
  • Circuit substrate stacking machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0009] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0010] See figure 1 and figure 2 , the present invention comprises a base 1, a conveyor 2 is installed on the base, two O-shaped conveyor chains 3 are arranged on the conveyor 2, and the two O-shaped conveyor chains 3 are arranged side by side and vertically, and between the two O-shaped conveyor chains 3 Brackets 4 that can move laterally are respectively arranged on the upper side of the outer side, and the rear sides of the brackets 4 are respectively connected with traverse cylinders 5 , and between the two O-shaped conveyor chains 3 , a jacking cylinder 6 is arranged on the base 1 . The O-shaped conveyor chains 3 are respectively set on the sprocket set 7, and the sprockets of the sprocket set 7 are arranged longitudinally to form a ring. The sprocket set includes a drive wheel 8 and a tensioning pulley 9 respectively. One of the drive...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a circuit substrate stacking machine, which can effectively complete the stack of circuit substrates without damaging the circuit substrate and can improve the production efficiency. The circuit substrate stacking machine comprises a base, wherein the base is provided with a conveyor, and the circuit substrate stacking machine is characterized in that the conveyor is provided with two O-shaped conveying chains, the two O-shaped conveying chains are distributed in the longitudinal direction side by side, supports which can move in the transverse direction are respectively arranged above the outer sides of the two O-shaped conveying chains, the rear side of each support is respectively connected with a translation air cylinder, and the base is provided with a jacking air cylinder between the two O-shaped conveying chains.

Description

technical field [0001] The invention relates to a circuit substrate production machine, in particular to a circuit substrate stacking machine. Background technique [0002] Generally, the circuit board has only a very narrow area around the edge without lines, which cannot be touched during the transportation and stacking process. It is difficult to complete the stacking of the existing equipment, and it is only solved by manpower. Not only the labor intensity of the workers is high, but the work efficiency is low. , cannot adapt to the requirements of modern production, and is easy to damage the circuit substrate. Contents of the invention [0003] In view of the above-mentioned defects in the prior art, the present invention provides a circuit substrate stacking machine, which can effectively complete the stacking of the circuit substrates without damaging the circuit substrates, and improves the production efficiency. [0004] It includes a base on which a conveyor is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B65H29/12B65H31/08
Inventor 高锡民
Owner WUXI MINGZHU TURBOCHARGER MFG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products