Apparatus and method for inspecting bonded plate-like objects
An inspection device and bonding board technology, applied in the direction of measuring devices, optical devices, image data processing, etc., can solve problems such as inability to easily inspect, a lot of time, and difficulty in detecting the edge of the adhesive 13
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[0062] The embodiments of the present invention will be described using the drawings.
[0063] Such as Figure 3A as well as Figure 3B The adhesive plate-shaped object inspection apparatus of one embodiment of the present invention is constructed as shown. As mentioned above, the adhesive plate inspection device (refer to Figure 1A , Figure 1B , Figure 2A , Figure 2B as well as Figure 2C ) Is to inspect the sensor panel assembly 10 (bonded plate) formed by bonding the sensor panel 11 (the first plate-shaped body) and the protective glass 12 (the second plate-shaped body) with the adhesive 13 Sensing panel assembly inspection device. In addition, Figure 3A Shows the basic structure viewed from the side of the sensing panel assembly inspection device, Figure 3B The basic structure viewed from above of the sensing panel assembly inspection device is shown.
[0064] in Figure 3A as well as Figure 3B Among them, the sensing panel assembly inspection device has a line sensing c...
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