Composition and method for preparing diamond wire saw with composition

A technology of diamond wire saw and composition, which is applied in the direction of sawing machine tools, manufacturing tools, metal sawing equipment, etc., which can solve the problems of low diamond cutting utilization rate, irregular diamond arrangement, poor processing accuracy, etc., and achieve line marks Shallow, high cutting utilization rate, high processing precision effect

Active Publication Date: 2013-04-10
CHANGSHA DIAT NEW MATERIAL SCI & TECH
View PDF4 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a composition and a method for preparing diamond wire saws, so as to solve the technical prob

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Composition and method for preparing diamond wire saw with composition
  • Composition and method for preparing diamond wire saw with composition
  • Composition and method for preparing diamond wire saw with composition

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0033] Another aspect of the present invention also provides a method for preparing a diamond wire saw, comprising the following steps:

[0034] Coating the shielding film: coating the aforementioned composition on the surface of the embryo wire, and through the curing step, the composition forms an organic organic shielding film with regular pores on the surface of the embryo wire to obtain the embryo wire with the organic shielding film;

[0035] Electroplating: the diamond particles are bonded to the pores of the embryo wire with an organic shielding film by electroplating to obtain a diamond wire saw with an organic shielding film;

[0036] Removing the organic shielding film: soak the diamond wire saw with the organic shielding film in an organic solvent to remove the organic shielding film to obtain the first diamond wire saw;

[0037] Reinforcement electroplating: The diamond wire saw is obtained by subjecting the initial diamond wire saw to the step of reinforcing elec...

Example Embodiment

[0047] Example 1

[0048] Composition 1 includes 95wt% ethyl alpha cyanoacrylate, 3wt% tackifier, 1wt% stabilizer, 2wt% polymerization inhibitor.

[0049] (1) Take diamond particles with a particle size of 10-20 μm and a steel wire with a diameter of 0.12 mm, remove oil with 10% Na(OH) aqueous solution, rinse with water, and then pickle with 5% aqua regia to remove surface impurities. Clean diamond particles and steel wire.

[0050] (2) Coating composition 1 on the surface of a clean steel wire, heating to 80° C., so that composition 1 forms an organic shielding film with regular pores and a thickness of 1 μm on the surface of the embryo wire to obtain a steel with an organic shielding film. Wire.

[0051] (3) Pass the steel wire with organic shielding film through the electroplating tank at a speed of 20m / min at 40°C, so that clean diamonds are regularly arranged at the unshielded pores in the steel wire to obtain a diamond wire saw with organic shielding film .

[0052] ...

Example Embodiment

[0054] Example 2

[0055] Composition 2 includes 90wt% alpha ethyl cyanoacrylate, 5wt% tackifier, 2wt% stabilizer, 3wt% polymerization inhibitor.

[0056] (1) Take diamond particles with a particle size of 40-50 μm and go through 10% Na(OH) aqueous solution to remove oil, rinse with clean water, and then pickle with 5% aqua regia to remove surface impurities to obtain clean diamond particles.

[0057] (2) Take a steel wire with a diameter of 0.25mm as the embryo wire, and degreasing the embryo wire in a 5wt% alkali solution and 2wt% acid washing and rust removal activation treatment to obtain a clean rigid wire.

[0058] (3) Coating composition 2 on the surface of a clean steel wire, heating to 90° C., so that composition 2 forms an organic shielding film with regular pores and a thickness of 3 μm on the surface of the embryo wire to obtain a steel having an organic shielding film. Wire.

[0059] (4) Pass the steel wire with organic shielding film through the electroplating ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
Thicknessaaaaaaaaaa
Granularityaaaaaaaaaa
Login to view more

Abstract

The invention provides a composition and a method for preparing diamond wire saw with the composition. The composition comprises the following raw materials by weight: 85-95wt% of alpha cyan ethyl acrylate, 3-8wt% of a tackifier, 1-3wt% of a stabilizer and 2-4wt% of a polymerization inhibitor. The method solves the technical problems of irregular arrangement of diamonds, uneven wire diameter, poor processing precision and low diamond cutting utilization rate in the prior art.

Description

technical field [0001] The present invention relates to the field of light-cured wire saws, in particular to a composition, and also to a method of using the aforementioned composition for preparing diamond wire saws. Background technique [0002] Hard and brittle materials include various silicon crystals, quartz crystals, sapphires, hard alloys and ceramic materials. Hard and brittle materials are mostly non-conductors or semiconductors, usually with high hardness, high brittleness, high wear resistance, high corrosion resistance, high oxidation resistance, high resistivity, high temperature resistance, non-magnetic conductivity and other properties. Due to the special properties of brittle and hard materials, higher requirements are put forward for the processing technology of brittle and hard materials. Cutting is the main step in the processing of brittle and hard materials. The cutting methods mainly include diamond saw blade cutting, band tool cutting, laser beam cut...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C09D4/04C09D7/12B23D65/00C25D15/00C25D5/02C25D7/06
CPCB23D65/00C25D15/00B23D61/185C25D7/0607C09D7/12C25D7/06C25D5/022C25D5/02
Inventor 刘纯辉
Owner CHANGSHA DIAT NEW MATERIAL SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap