Additive for roughening surface of copper foil

A technology of surface roughening and additives, which is applied in the secondary treatment of printed circuits and the improvement of the metal adhesion of insulating substrates. The effect of fine particles, high peel strength and uniform distribution

Inactive Publication Date: 2013-04-17
建滔(连州)铜箔有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in the manufacturing process of electrolytic copper foil, the roughening process in the surface treatment process generally does not add additives or add elements that are easy to cause harm to the human body such as arsenic, antimony, and cadmium. , or not environmentally friendly
When the existing electr

Method used

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  • Additive for roughening surface of copper foil
  • Additive for roughening surface of copper foil
  • Additive for roughening surface of copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The untreated 35 μm wool foil was pickled according to the prior art. After pickling, the wool foil enters the roughening tank for roughening. The copper content of the roughening solution in the roughening tank is 5-20g / L, the content of sulfuric acid is 100-200g / L, and the content of sodium molybdate is 300mg / L. The content of stannous sulfate is 150mg / L, and the electroplating is carried out according to the operating method of the prior art at 10-40°C. After roughening, proceed with curing, heat-resistant layer treatment, anti-oxidation, coupling agent coating and drying treatment according to the methods in the prior art to obtain copper foil. The anti-peel strength of the obtained copper foil is 1.75kgf / cm, and the roughened particles of the copper foil are fine and evenly distributed (see image 3 ).

Embodiment 2

[0023] The 35 μm wool foil without surface treatment was pickled according to the existing technology. After pickling, the wool foil enters the roughening tank for roughening. The copper content of the roughening solution in the roughening tank is 5-20g / L, the content of sulfuric acid is 100-200g / L, and the content of sodium molybdate is 30mg / L. The content of cobalt sulfate is 200mg / L, the content of ferrous sulfate is 100mg / L and the content of hydrochloric acid is 60mg / L, and electroplating is carried out according to the operation method of the prior art at 10-40°C. After roughening, proceed with curing, heat-resistant layer treatment, anti-oxidation, coupling agent coating and drying treatment according to the methods in the prior art to obtain copper foil. The anti-peel strength of the obtained copper foil is 1.70kgf / cm, and the roughened particles of the copper foil are fine and evenly distributed.

Embodiment 3

[0025] The 35 μm wool foil without surface treatment was pickled according to the existing technology. After pickling, the wool foil enters the roughening tank for roughening. The copper content of the roughening solution in the roughening tank is 15g / L, the content of sulfuric acid is 150g / L, the content of ammonium molybdate is 30mg / L, and the content of cobalt sulfate is 200mg / L, 80mg / L phosphorous acid, 200mg / L titanium sulfate, 150mg / L nickel sulfate, 100mg / L ferrous sulfate and 60mg / L hydrochloric acid. There are technical operating methods for electroplating. After roughening, proceed with curing, heat-resistant layer treatment, anti-oxidation, coupling agent coating and drying treatment according to the methods in the prior art to obtain copper foil. The anti-peel strength of the obtained copper foil is 1.65kgf / cm, and the roughened particles of the copper foil are fine and evenly distributed.

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Abstract

The invention discloses an additive for roughening a surface of a copper foil. The additive is composed of two or more of a nickel-containing compound, a molybdenum-containing compound, a cobalt-containing compound, a ferrum-containing compound, a phosphorus-containing compound, a titanium-containing compound, a tin-containing compound and a chlorine-containing compound. The additive is applied in a roughening process of the surface of the copper foil, so that the manufactured copper foil does not contain arsenic, antimony, cadmium and other elements which can easily harm a human body; the roughed particles of the copper foil are fine and are distributed uniformly; the peel strength is high; and the additive for roughening the surface of the copper foil is applicable for manufacturing high-quality plates such as high Tg plates, halogen-free plates and flexible plates.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil production technology, in particular to an additive for roughening the surface of copper foil. Background technique [0002] Electrolytic copper foil is an important material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCB). In the rapid development of today's electronic information industry, electrolytic copper foil is called the "neural network" of electronic product signal and power transmission and communication. The production process of electrolytic copper foil mainly includes the following three processes: copper melting and raw foil, surface treatment and product slitting. Among them, surface treatment includes pickling, roughening, curing, heat-resistant layer treatment, anti-oxidation, coupling agent coating and drying treatment processes (such as figure 1 shown). At present, in the manufacturing process of electrolytic copper foil, ...

Claims

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Application Information

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IPC IPC(8): H05K3/38C25D3/58
Inventor 吴伟安郭伟黄文荣
Owner 建滔(连州)铜箔有限公司
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