Transition electrode for light-emitting diode (LED) integration packaging module and manufacturing method thereof
A transition electrode, integrated packaging technology, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of LED integrated packaging module fault maintenance difficulties, etc., to solve the problem of bonding fault maintenance difficulties, flexible chip arrangement, and increase service life. Effect
Inactive Publication Date: 2013-05-08
SHIJIAZHUANG EMPOLDER SHENTONG MACHINE ELECTRIC EMPOLDER
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a transition electrode for LED integrated packaging module and its manufacturing method, using the transition electrode to connect LED chips to form an LED integrated packaging module, which solves the problems of difficult maintenance of LED integrated packaging modules, etc. , and the chip arrangement is more flexible
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[0023] In order to achieve bonding and ease of use, the transition electrode structure is determined to be figure 1 In the polyhedral structure shown, the upper part is an electrode, the lower part is a substrate, and the upper and lower surfaces are parallel. In order to meet the optical and electrical characteristics of LED integrated packaging modules and the purpose of mass production, the transition electrode must have the following characteristics:
[0024] 1. The substrate material has a low absorption rate of light. The LED integrated packaging module is a light generating device. The light absorption rate of the material in the device will affect the light extraction efficiency of the overall device. The substrate material of the transition electrode should try to select a material that absorbs less light; 2. The substrate material is generally Must be insulated. Because the general LED is integrated and packaged on the metal substrate, in order to prevent the tran...
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The invention discloses a transition electrode for a light-emitting diode (LED) integration packaging module and a manufacturing method thereof, and relates to the technical field of elements of a connecting device inside a lighting device. The transition electrode comprises a substrate and an electrode, the electrode is fixedly arranged on the upper surface of the substrate, and the area of the electrode is greater than the area of an LED chip electrode. A plurality of transition electrodes are inserted into among LED chips so as to enable the LED chips to be connected with a lead through the transition electrode. Damaged LED chips can be replaced conveniently, and the problem that bonding breakdown maintenance of the LED chips is difficult in production is effectively solved. Furthermore, chip layout can be more flexible, besides circuit structures such as series connection before parallel connection, more complex circuit structures such as parallel connection before series connection can also be designed, the influence of the damaged LED chips on the module is lowered, and thereby the service life of the LED integration packaging module is prolonged.
Description
technical field [0001] The invention relates to the technical field of components of a connecting device in an illuminating device, in particular to an electrode used for an LED package. Background technique [0002] At present, a common method of LED integrated packaging is that the chips are arranged on the substrate in a matrix structure. The substrate is mostly a metal substrate, and there are also ceramic substrates, ceramic-metal composite substrates, and resin-metal composite substrates. Bonding on the corresponding positive and negative electrodes of the two LED chips to realize the series circuit connection between the chips, the structure is as follows figure 2 shown. [0003] Using this bonding method, the LED chips are connected in series one by one to form a group. The positive and negative electrodes of the first and last two LED chips in this series group that have not participated in the bonding are respectively bonded to the designated lead positions that c...
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IPC IPC(8): H01L33/38H01L33/40
Inventor 谷青博崔泽英
Owner SHIJIAZHUANG EMPOLDER SHENTONG MACHINE ELECTRIC EMPOLDER