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Flame-retardant thermal-conductive plastic composition

A technology of thermally conductive plastics and compositions, applied in heat exchange materials, chemical instruments and methods, etc., can solve problems such as non-compliance with fire protection requirements, and achieve the effects of excellent stability, excellent heat dissipation performance, and low thermal impedance

Inactive Publication Date: 2013-05-22
KENNER MATERIAL & SYST
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  • Abstract
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  • Claims
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Problems solved by technology

[0007] In addition, as explosions of household appliances continue to spread, the safety regulations of daily electrical appliances are gradually being paid attention to. For example, the safety regulations of LED lamps and bulbs have the following regulations: China Taiwan CNS14335, CNS15436 and CNS15438, North America UL-1993&UL- 8750, Canadian CSA1993-2009, European IEC / EN 62560 and IEC / EN 60598-1, Korean KS C 7651-7653, review the above regulations and require a fire rating of at least V1 or above, but most of the products on the market do not meet the fire protection requirements, so the development Flame-retardant, heat-conducting and high-impedance multifunctional plastics will be able to meet future market demands and be widely used in various components and household appliances

Method used

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  • Flame-retardant thermal-conductive plastic composition

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Embodiment

[0049] Please refer to Table 1 for the proportions and measurement results of the components of Examples 1 to 13:

[0050] Table 1: The formula and physical property table of embodiment 1-13

[0051]

[0052] Can find out the proportioning of different embodiments of the present invention from the table. Wherein, polyolefin, thermoplastic elastomer, aluminum, aluminum nitride, boron nitride, aluminum oxide, zinc oxide, magnesium hydroxide, aluminum hydroxide, zinc borate or coupling agent are expressed as weight percent.

[0053] The production methods of the examples are all to put polyolefin, thermoplastic elastomer, inorganic filler, fireproofing agent and coupling agent into the feeding hopper respectively, knead and granulate by using a co-rotating twin-screw extruder. Wherein, the screw speed is controlled at 150 to 200 rpm. After the pellets are obtained, injection molding is performed with an injection molding machine at a screw heating temperature of 210° C. and ...

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Abstract

The invention discloses a flame-retardant thermal-conductive plastic composition. The flame-retardant thermal-conductive plastic composition comprises the following components in percentage by weight: 5%-45% of polyolefin A, 3%-25% of thermoplastic elastomer B, 35%-85% of thermal-conductive filler C, 5%-55% of non-phosphorus, non-nitrogen and non-halogen fire-proofing agent D and 0.5%-6% of coupling agent E. The composition disclosed by the invention has a fireproof level of UL94VL or higher, a thermal conductive coefficient bigger than 1.0 Watts / m-K, thermal deformation temperature of 105 DEG C or higher and high surface impedance. Besides, the composition has good processability and can be formed through injection-molding, extruding or hot-pressing molding.

Description

technical field [0001] The invention relates to a composition of flame-retardant heat-conducting plastics. Background technique [0002] When the heat energy generated by electronic components, circuit boards or diodes continues to accumulate, it is easy to cause incorrect operation of components, component failure, reduced efficiency or shortened service life. Therefore, how to effectively dissipate heat is very important for these electronic components. [0003] Traditional methods of dissipating heat from electronic components mostly use metal plates as heat dissipation materials. However, compared with polymer materials, metal materials are more expensive and difficult to process. However, the use of polymer materials has another major disadvantage, that is, the thermal conductivity of polymer materials is about 0.1 to 0.5Watts / m-K, which is far less good than that of metals. Therefore, in order to make up for the lack of thermal conductivity of polymers, many research...

Claims

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Application Information

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IPC IPC(8): C08L23/00C08L53/00C09K5/14C08K13/02C08K13/04C08K7/14C08K3/08C08K3/28C08K3/38C08K3/22
Inventor 林优恩颜景辉
Owner KENNER MATERIAL & SYST
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