Wafer-level light emitting diode package and method of fabricating the same

Abstract

Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package includes a semiconductor stack including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a plurality of contact holes arranged in the second conductive type semiconductor layer and the active layer, the contact holes exposing the first conductive type semiconductor layer; a first bump arranged on a first side of the semiconductor stack, the first bump being electrically connected to the first conductive type semiconductor layer via the plurality of contact holes; a second bump arranged on the first side of the semiconductor stack, the second bump being electrically connected to the second conductive type semiconductor layer; ; and a protective insulation layer covering a sidewall of the semiconductor stack.

Description

technical field [0001] The present invention relates to a light-emitting diode package and its manufacturing method, more specifically, to a wafer-level light-emitting diode package and its manufacturing method. Background technique [0002] A light emitting diode (LED) is a semiconductor device including an N-type semiconductor and a P-type semiconductor and emitting light through recombination of holes and electrons. Such LEDs have been used in a wide range of applications such as display devices, traffic lights, and backlight units. In addition, considering potential advantages of lower power consumption and longer life than current electric bulbs or fluorescent lamps, the application range of LEDs has been expanded to general lighting by replacing current incandescent lamps and fluorescent lamps. [0003] LEDs can be used in LED modules. The LED module is manufactured through a process of manufacturing LED chips at a wafer level, a packaging process, and a modulation p...

AI Technical Summary

Problems solved by technology

[0009] Since an AC-LED includes a light emitting unit on a growth substrate (for example, on a sapphire substrate),

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