Integrated circuit packaging structure with electromagnetic shielding structure

Abstract

The invention discloses an integrated circuit package structure with an electromagnetic shielding structure. The integrated circuit package structure with the electromagnetic shielding structure comprises a plurality of integrated circuit chips, wherein the plurality of integrated circuit chips are respectively arranged on a pinboard and a package substrate, the electromagnetic shielding structure is arranged on the edge of the pinboard, and is used for separating the integrated circuit chips on the pinboard and the integrates circuit chips on the package substrate, and the electromagnetic shielding structure is composed of vertical through holes filled with metal or grooves filled with metal in the pinboard, metal connection wires on the front side of the pinboard, metal connection wires on the back of the pinboard and a bonding pad. The metal connection wires on the front side of the pinboard and the metal connection wires on the back of the pinboard are used for connecting arrays composed of the vertical through holes filled with the metal or the grooves filled with the metal together to form a metal grid so as to block and absorb electromagnetic waves. Due to the fact that the electromagnetic shielding structure is arranged on the pinboard, the problem of electromagnetic interference among the plurality of integrated circuit chips in system package is solved, and the integrated circuit chips on the silicon pinboard are protected from being influenced by the integrated circuit chips with strong electromagnetic radiation, such as a radio frequency module, on the package substrate.

Description

technical field [0001] The invention relates to system-level packaging, in particular to an integrated circuit packaging structure with an electromagnetic shielding structure. Background technique [0002] With the continuous reduction of VLSI feature size, the corresponding electronic products have also become miniaturized and portable. However, when the feature size of IC shrinks to a few nanometers, the emergence of the gate oxide thickness limit makes people generally think that the traditional Moore's Law has come to an end. The pursuit of breaking through the physical limit and the need for heterogeneous integration lead to the emergence of the concept of "more than moore", and the entire industry is looking for another system integration solution. The system-in-package technology represented by 2.5DIC and 3DIC is a good interpretation of the concept of "morethanmoore". [0003] System-in-package technology (system in package, SIP) is a packaging method in which all ...

AI Technical Summary

Problems solved by technology

[0005] However, in the traditional 2.5DIC package, it is always difficult to integrate parts with strong electromagnetic radiation such as RF chips into the package due to the close distance between chips and the dielectric loss problem on the silicon interposer.

At the same time, some components that are not easy to be placed on the adapter board are also difficult to enter the 2.5D packaging system

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