Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board

Abstract

Provided is a copper foil with carrier capable of providing wirings of line / space=15 [mu] m / 15 [mu] m or less on a printed circuit board on which copper foils are laminated. Also provided are a printed circuit board and a multilayer printed circuit board capable of providing wirings with fine patterns of line / space=15 [mu] m / 15 [mu] m or less using the copper foil. A copper foil with carrier obtained by laminating a release layer and a copper foil in this order on a carrier foil having an average interval Sm of 25 [mu] m or more between irregularities of a substrate crest on the surface, the Sm being defined in JIS-B-06012-1994, and by laminating a release layer and a copper foil in this order on a carrier foil which is a copper foil obtained by peeling the former copper foil from the former carrier foil, wherein the interval between irregularities of a substrate crest on the surface of the carrier foil on which copper foils are laminated is 25 [mu]m or more as the average interval Sm defined in JIS-B-06012-1994. A roughening process layer and a surface treatment layer are laminated in this order on the surface of the copper foil as needed.

Description

technical field [0001] The present invention relates to a copper foil or a copper foil with a carrier, in particular to a copper foil or a copper foil with a carrier suitable for use in the preparation of a high-density micro-wiring printed circuit board or a multilayer printed circuit board and a preparation method thereof. [0002] Moreover, this invention relates to the printed wiring board which used the said copper foil or the said copper foil with a carrier, and a multilayer printed wiring board. Background technique [0003] As the copper foil used for high-density fine wiring (fine pattern) applications, a copper foil having a thickness of 1 to 9 μm, particularly preferably 1 to 5 μm, is used. [0004] Such thin copper foils used in fine graphic applications are mainly on the market as copper foils with carriers. The copper foil with a carrier is produced by using an electrolytic copper foil as a carrier foil, providing a peeling layer of 1 μm or less on the carrier...

AI Technical Summary

Problems solved by technology

[0009] In this way, only the surface roughness Rz of the carrier foil is specified, and the surface roughness of the copper foil deposited on it is not necessarily smooth, and sometimes it cannot meet the requirements of copper foil for printed circuit boards forming fine patterns.

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