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Metamaterial encapsulation tool and metamaterial encapsulation method

An encapsulation method and metamaterial technology, applied in the field of metamaterials, can solve problems such as the inability to solve the encapsulation of liquid curable materials

Active Publication Date: 2017-04-12
KUANG CHI INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the current packaging tools and packaging methods are only for the case where the filler is a solid material, but they cannot solve the packaging problem when the liquid curable material is used

Method used

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  • Metamaterial encapsulation tool and metamaterial encapsulation method
  • Metamaterial encapsulation tool and metamaterial encapsulation method
  • Metamaterial encapsulation tool and metamaterial encapsulation method

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Embodiment Construction

[0036] The technical solutions of the present invention will be described in detail below in combination with preferred embodiments of the present invention.

[0037] It should be understood that the following descriptions (including the accompanying drawings) are only exemplary rather than limiting descriptions of the present invention. The specific number of components will be involved in the following description, but it should also be understood that these numbers are only exemplary, and those skilled in the art can arbitrarily select an appropriate number of components with reference to the present invention. Moreover, words such as "first" and "second" mentioned in the present invention do not indicate the ranking of the importance of the components, but are only used to distinguish the names of the components.

[0038] Unless otherwise clearly defined, terms used in the context of the present application have meanings commonly used in the art.

[0039] figure 1 and ...

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Abstract

The invention relates to a metamaterial packaging tool. The packaging tool comprises a horizontal adjusting platform, a mould bottom plate mounted on the horizontal adjusting platform, an opening type mould main body mounted on the mould bottom plate, a sealing rubber ring mounted between the mould bottom plate and the opening type mould main body, and a positioning frame which is detachably mounted on the opening type mould main body. The invention further relates to a metamaterial packaging method. With the adoption of the metamaterial packaging tool and the metamaterial packaging method disclosed by the invention, a metamaterial structure of a curable material with liquid-state fillers can be can be rapidly and conveniently packaged.

Description

[0001] 【Technical field】 [0002] The invention relates to the field of metamaterials, in particular to a metamaterial packaging tool and a metamaterial packaging method. [0003] 【Background technique】 [0004] Metamaterials refer to some artificial composite structures or composite materials with extraordinary physical properties that natural materials do not have. Through the orderly design of the structure on the key physical scale of the material, it is possible to break through the limitations of some apparent natural laws, so as to achieve supernormal material functions beyond the ordinary properties inherent in nature. The properties and functions of metamaterials are mainly derived from their internal structure rather than the materials from which they are composed. The special properties of metamaterials depend largely on the key physical scales of the materials. One of the most intuitive examples is crystals. Crystals are ordered at the atomic scale, and because o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C70/68
Inventor 刘若鹏赵治亚法布里齐亚·盖佐李国振
Owner KUANG CHI INST OF ADVANCED TECH