A kind of manufacturing process of step formwork
A technology of making crafts and steps, which is applied in the field of making crafts of step templates to achieve the effect of high position accuracy
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2016-12-14
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
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Abstract
Description
technical field
[0001] The invention relates to a manufacturing process of a step template, which belongs to the field of material manufacturing and processing, and specifically relates to a PCB surface in the field of PCB manufacturing with a down step step area and a planar area with a graphic opening. The manufacturing process of the printing mask plate with no pattern opening in the area. Background technique
[0002] With the pursuit of miniaturization of electronic products, the perforated plug-in components used before can no longer be reduced; the functions of electronic products are more complete, and the integrated circuits (ICs) used can no longer perforate components, especially large-scale and highly integrated ICs, which have to use surface SMT components, so the stencil printing process has developed rapidly in the electronics manufacturing industry, and SMT printing is a typical example. The procurement of templates is not only the first step in the SMT asse...
Examples
Embodiment Construction
[0057] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0058] The invention discloses a manufacturing process of a step formwork.
[0059] Its technological process is as follows:
[0060] Electroforming the first electroforming layer: core mold treatment → pretreatment (degreasing, pickling, sandblasting) → film 1 → exposure 1 → single-sided development 1 → electroforming 1 → film fading → peeling;
[0061] The down step of etching the PCB surface: electroforming layer double-sided film → PCB surface exposure → PCB surface development → PCB surface etching → film fading → subsequent proces...