73results about How to "Smooth hole" patented technology

The invention aims to overcome the defect of insufficient binding force between the zipper teeth and the strap of the injection molding zipper in the prior art, and provides an injection molding zipper in a novel structure. In the injection molding zipper of the invention, the strap in the binding face region between the zipper teeth and the strap is provided with a small hole, at least one small hole or more than more small holes is / are arranged in the binding face region between the strap and each single zipper tooth, and the small holes are uniformly distributed in the arrangement direction of the zipper teeth. The small holes can ensure the injection molding material liquid, which is melted by the injection molding machine, to pass through in the production process of the injection molding zipper, so that the injection molding material liquid forms molding upright posts in the small holes after being cooled, and the molding upright posts and the zipper teeth can form an integral body. The injection molding zipper of the invention fundamentally changes the binding mode between the zipper teeth and the zipper strap of the injection molding zipper, which means to change the mode of the injection molding material wrapping the central line in the binding face region of the zipper strap, thereby obviously enhancing the binding force between the zipper teeth and the zipper strap of the injection molding zipper.

A step stencil and a hybrid production process thereof. The step stencil is a metal mask having up steps on a PCB surface, and the base material of the mask is one of stainless steel, pure nickel and a nickel-iron alloy. The hybrid production process flow is as follows: (1) the fabrication of the up step area on the stencil PCB surface; (2) the fabrication of a half-etched blind hole of the stencil; (3) the fabrication of stencil openings; and (4) subsequent processing of the stencil openings. The hybrid production process includes three processes of etching, laser cutting and electropolishing, by using which the metal stencil having the PCB surface with up step can be produced. Through the fabrication of the half-etched blind holes, alignment holes for precise alignment can be produced; the metal screen has an opening pattern both in the flat area and the up step area; and the opening has good quality, smooth hole walls, and no blurs; by using the etching process, the stencil surface can be made to be flat and no-tilting phenomenon; and the flat area of the metal stencil has good thickness uniformity.

The invention discloses a three-dimensional mask plate for printing. The three-dimensional mask plate comprises a substrate, and a printing surface and a printed circuit board (PCB) surface, which are arranged on two sides of the substrate, wherein the mask plate is provided with a plurality of graphic openings and a three-dimensional structure, the three-dimensional structure comprises a projection area which is arranged on the printing surface and a concave area which is arranged on the PCB surface. The mask plate is provided with the three-dimensional projection part and the three-dimensional concave part, the height of the projection is 0.1mm to 10mm, the concave depth is 0.1mm to 10mm, and angles formed between the projection part and the plate surface and between the concave part and the plate surface are 80 to 90 DEG; the mask plate is made of pure nickel, and the precision is high; the uniformity is high, the quality is good, and high brightness, no rough spot, no scratch and no pin hole can be realized; and the opening quality is good, and the wall is smooth and free from burrs; and the mask plate is low in production cost, simple in process and low in energy consumption.

The invention relates to a puncturing device, in particular to a mushroom bag puncturing device. The object of the invention is to provide the mushroom bag puncturing device capable of punching a plurality of holes simultaneously, having high puncturing efficiency and punching the holes with uniform densities. According to the technical scheme, the mushroom bag puncturing device comprises a mounting plate, brackets, a fixing table, a mounting seat, a rotating motor, a crank, a connecting rod, a first sliding rail, a first sliding block, a first mounting block, a second mounting blocks and thelike; the brackets are arranged on the left and right sides of the bottom of the mounting plate, the fixing table is arranged on the top right side of the mounting board, the mounting seat is arrangedon the top of the fixing table, the rotating motor is mounted on the mounting seat, and an output shaft of the rotating motor is provided with the crank. The device can punch a plurality of holes ata time by arranging a plurality of inserting rods on the first mounting block, thereby greatly improving the efficiency of the hole puncturing, the size of each of the inserting rods is uniform, the spacing of the adjacent inserting rods is the same, and the hole densities of the holes punched are uniform.

The invention relates to a composite movable mold frame for a cast-in-situ box beam. The composite movable mold frame mainly comprises a corbel supporting bracket, a horizontal movement railway, pulley block platforms, longitudinal bailey beams, horizontal bailey beams, external mold brackets, horizontal movement platforms, horizontal movement jacks A, a longitudinal movement jack and horizontal movement jacks B, wherein the horizontal movement jacks A are arranged on the side surface of the pulley block platforms and the side surface of the horizontal movement railway, one ends of the horizontal movement jacks A are fixed on the pulley block platforms, and the other ends of the horizontal movement jacks A are fixed on the horizontal movement railway; the longitudinal movement jack is arranged under the longitudinal bailey beams in a longitudinal direction; a base of the longitudinal movement jack is fixed on the pulley block platforms, and the other end of the base is fixed on a longitudinal movement guide rail beam through a connecting fitting E; and the external mold brackets adopt a structure that two sides of the external mold bracket are in symmetry and separation, and bottom mold plates on two sides are fixed together through bolts. The structure of the composite movable mold frame disclosed by the invention is convenient to disassemble and assemble and high in construction efficiency, repeated disassembling of supports and mold frame structures is not needed, automated hole penetration of the movable mold frame and a main beam can be realized, the serial construction of the cast-in-situ box beam is realized, and good economic and technical benefits are achieved.

A production method for a step stencil. Specifically, the production process flow is as follows: electroforming a first electroformed layer: core mold treatment->pre-treatment (degreasing, pickling and sandblasting)->film mounting 1->exposure 1->single sided development 1-> electroforming 1; electroforming up steps on a PCB surface: pretreatment (pickling and sandblasting)->double sided film mounting 2->double sided exposure 2->double sided development 2t->electroforming 2->film stripping->mold stripping; and etching down steps on the PCB surface: double sided film mounting on the electroformed layer->PCB surface exposure->PCB surface development->PCB surface etching ->film stripping->follow-up treatment (degreasing and pickling). By employing the method, the produced electroformed stencil has the PCB surface with up steps and down steps, and the step areas have opening patterns. The method of the invention solves the following technical problems: the pattern openings of the obtained up step area are in high position alignment precision with the openings of the first electroformed layer; the produced entire electroformed stencil has smooth opening hole walls, no undesirable phenomena such as blurs and diffusion coating, good surface quality, no undesirable defects such as pinholes and pittings; the stencil thickness uniformity COV is less than 10%; the stencil surface is in first grade brightness; and the bonding strength of the electroformed layer of the up step area and the first electroformed layer is strong, without the proneness of falling off.

The present invention relates to a production method for an electroformed stencil with mark points, including the production of the electroformed stencil and the production of the mark points. The production method is characterized by comprising the steps of: placing the fixed electroformed stencil on a cutting base platform; selecting any two openings diagonally positioned on the electroformed stencil, reading coordinates of specific points of the openings, positioning the electroformed stencil through the coordinates of specific points, and determining coordinates of the mark points via comparing with an original file; adjusting cutting parameters and the vertical height of a laser cutting head to enable a laser focus to fall on the surface of the electroformed stencil; and emitting laser light through the laser cutting head to perform cutting at the mark point area on the surface of the electroformed stencil. According to the production method for the electroformed stencil with mark points, the obtained electroformed stencil has good surface quality, no pinholes or pittings, thereby improving printing quality; and the mark points have high positioning accuracy, and relatively high degrees of recognition, improving alignment accuracy of a PCB with the electroformed stencil.