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A hybrid production process and a step stencil produced by using the process

A preparation process and step technology, which is applied in the photoplate making process of pattern surface, printing process, preparation of printing surface, etc., can solve the problems of high bonding force and reduced lifespan, and achieve high bonding force, smooth hole wall, and good position high precision effect

Inactive Publication Date: 2013-07-17
KUN SHAN POWER STENCIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] For the local thickening technology, the key point is that the opening position of the up step pattern area and the opening position of the substrate pattern area should have high precision, and at the same time, the bonding force should be strong, otherwise the lifespan will be greatly reduced

Method used

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  • A hybrid production process and a step stencil produced by using the process
  • A hybrid production process and a step stencil produced by using the process
  • A hybrid production process and a step stencil produced by using the process

Examples

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Embodiment Construction

[0090] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0091] Mandrel processing → pre-treatment (degreasing, pickling, sandblasting): choose 0.3mm stainless steel as the mandrel, and cut the substrate to the required size, and sandblast the cut steel sheet on both sides to improve the surface roughness degree, so as to improve the bonding force between the dry film and the steel sheet when sticking the film.

[0092] Single-sided film 1: A dry film with high adhesion must be selected to prevent the film from falling off during the electroforming process. After selecting the dry film, stick...

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PUM

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Abstract

A hybrid production process and a step stencil produced by using the process. The hybrid production process is as follows: electroforming a first electroformed layer; electroforming the up step area on a PCB surface; and etching a down step area on a printing surface. The hybrid production process is characterized by comprising two techniques of electroforming and etching. The stencil produced by the process has external characteristics of: the PCB surface having up steps, and the printing surface having down steps and having an opening pattern. According to the metal stencil, the produced electroformed layer of the up step area has a relatively high bonding strength with the plane electroformed layer; the produced entire electroformed stencil has smooth opening walls, good surface quality and has no pinholes or pittings; the thickness uniformity of the opening pattern area of the produced entire electroformed stencil is good; and a special spreader plate used in the second electroforming process can effectively reduce the current density, thereby reducing the edge effect of the up step area.

Description

[0001] technical field [0002] The invention relates to a mixed preparation process and a step formwork prepared by the process, belonging to the field of material manufacturing and processing. It specifically relates to a process combining electroforming and etching, and a printing mask with raised steps (up steps) on the PCB surface and down steps (down steps) on the printing surface in the SMT field prepared by using the mixed process. [0003] Background technique [0004] With the pursuit of miniaturization of electronic products, the perforated plug-in components used before can no longer be reduced; the functions of electronic products are more complete, and the integrated circuits (ICs) used can no longer perforate components, especially large-scale and highly integrated ICs, which have to use surface SMT components, so the stencil printing process has developed rapidly in the electronics manufacturing industry, and SMT printing is a typical example. The procureme...

Claims

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Application Information

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IPC IPC(8): B41C1/12B41N1/04B41N3/03G03F7/00
Inventor 魏志凌高小平
Owner KUN SHAN POWER STENCIL
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