A production method for a step stencil

Abstract

A production method for a step stencil. Specifically, the production process flow is as follows: electroforming a first electroformed layer: core mold treatment->pre-treatment (degreasing, pickling and sandblasting)->film mounting 1->exposure 1->single sided development 1-> electroforming 1; electroforming up steps on a PCB surface: pretreatment (pickling and sandblasting)->double sided film mounting 2->double sided exposure 2->double sided development 2t->electroforming 2->film stripping->mold stripping; and etching down steps on the PCB surface: double sided film mounting on the electroformed layer->PCB surface exposure->PCB surface development->PCB surface etching ->film stripping->follow-up treatment (degreasing and pickling). By employing the method, the produced electroformed stencil has the PCB surface with up steps and down steps, and the step areas have opening patterns. The method of the invention solves the following technical problems: the pattern openings of the obtained up step area are in high position alignment precision with the openings of the first electroformed layer; the produced entire electroformed stencil has smooth opening hole walls, no undesirable phenomena such as blurs and diffusion coating, good surface quality, no undesirable defects such as pinholes and pittings; the stencil thickness uniformity COV is less than 10%; the stencil surface is in first grade brightness; and the bonding strength of the electroformed layer of the up step area and the first electroformed layer is strong, without the proneness of falling off.

Description

[0001] technical field [0002] The invention relates to a method for making a stepped template, which belongs to the field of material manufacturing and processing, and in particular to a printing mask in the field of SMT with raised steps and recessed steps on the PCB surface, and both the step region and the plane region have opening patterns production process. [0003] Background technique [0004] With the pursuit of miniaturization of electronic products, the perforated plug-in components used before can no longer be reduced; the functions of electronic products are more complete, and the integrated circuits (ICs) used can no longer perforate components, especially large-scale and highly integrated ICs, which have to use surface SMT components, so the stencil printing process has developed rapidly in the electronics manufacturing industry, and SMT printing is a typical example. The procurement of templates is not only the first step in the SMT assembly process, but ...

AI Technical Summary

Problems solved by technology

[0007] Therefore, using the combination of etching and electroforming to prepare metal templates with up steps and down steps on the PCB surface has attracted much attention, but it also has certain challenges.

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