Three-dimensional mask plate for printing

Abstract

The invention discloses a three-dimensional mask plate for printing. The three-dimensional mask plate comprises a substrate, and a printing surface and a printed circuit board (PCB) surface, which are arranged on two sides of the substrate, wherein the mask plate is provided with a plurality of graphic openings and a three-dimensional structure, the three-dimensional structure comprises a projection area which is arranged on the printing surface and a concave area which is arranged on the PCB surface. The mask plate is provided with the three-dimensional projection part and the three-dimensional concave part, the height of the projection is 0.1mm to 10mm, the concave depth is 0.1mm to 10mm, and angles formed between the projection part and the plate surface and between the concave part and the plate surface are 80 to 90 DEG; the mask plate is made of pure nickel, and the precision is high; the uniformity is high, the quality is good, and high brightness, no rough spot, no scratch and no pin hole can be realized; and the opening quality is good, and the wall is smooth and free from burrs; and the mask plate is low in production cost, simple in process and low in energy consumption.

Description

technical field [0001] The invention relates to a three-dimensional mask, in particular to a three-dimensional mask for printing. Background technique [0002] With the rapid development of my country's electronics industry, stencil printing technology has also been applied in the electronics manufacturing industry, and SMT printing is a typical example. In the manufacturing process of electronic products, soldering electronic components and PCB needs to put tin on the PCB first, and there are hundreds of pads on the PCB that need to be tinned. The position of each pad corresponds to the electronic component. The best way to accurately tin the pads that need to be tinned at one time is to print. The usual method used in the electronics manufacturing industry is to make a stainless steel sheet with numerous small holes, each hole corresponds to a pad that needs to be tinned, and then paste the stainless steel sheet on the stretched mesh, and the mesh is pasted. On the under...

AI Technical Summary

Problems solved by technology

In the field of high-precision manufacturing, even small convex and concave parts on the surface of the substrate will cause large deviations in positional accuracy and dimensional accuracy during the transfer process and deformation of the mask, resulting in scrapping of products and masks

When using two-dimensional mask transfer, the mask opening at the edge of the concave-convex area on the substrate surface cannot be precisely aligned because it cannot be in close contact with the substrate, resulting in deviation transfer or dislocation transfer of the transfer material

In the prior art, pad printing is often used for non-planar printing, but pad printing has problems such as small printing effective area and poor printing effect, especially for large-area printing products that cannot meet its requirements, and requires equipment Large investment and high cost

Therefore, the traditional pad printing method can no longer meet the current requirements for screen printing of special-shaped products

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