Beam forming device and method
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 北京中科镭特电子有限公司
- Publication Date
- 2014-11-19
Smart Images
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of laser processing, and relates to a beam forming device and a method thereof in laser drilling equipment, and is especially suitable for micro-hole processing of high-hard-brittle materials. Background technique
[0002] Laser processing technology has penetrated into all walks of life, especially in high-precision industries such as microelectronics and aerospace. The requirements for processing size are getting smaller and higher, and laser processing has become an irreplaceable Methods. In the type of material processing, drilling occupies a large proportion. There are generally four types of laser drilling: single-pulse drilling, multi-pulse drilling, rotary drilling, and spiral drilling.
[0003] At present, the better technology is spiral drilling. After the laser is focused by the focusing lens, it acts on the surface of the workpiece. The beam moves along the processing track. After a layer of ma...