A production process for a step stencil by using an electroforming method
A manufacturing process and step technology, which is applied in the field of material manufacturing and processing, can solve the problems of high bonding force and reduced lifespan, and achieve the effect of high bonding force, smooth hole wall, and good thickness uniformity
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[0084] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the drawings are exemplary, and are only used to explain the present invention, but should not be understood as limiting the present invention.
[0085] The specific process flow of this method and the attention issues in the process flow of the present invention will be described in more detail in the following description.
[0086] The specific process flow of the template with the up step area on the electroformed PCB surface and the down step area on the printed surface is:
[0087] (1) Electroforming the first electroforming layer:
[0088] a. Core mold processing: Choose 1.8mm stainless steel as the core mold and cut the substrate to the required size...
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