A production process for a step stencil by using an electroforming method

Abstract

A production process for a step stencil by using an electroforming method. The specific process flow is as follows: electroforming a first electroformed layer: core mold processing -> pre-treatment (degreasing, pickling and sandblasting) -> film mounting 1 -> exposure 1 -> single sided developing 1 -> electroforming 1; electroforming an up step area on a PCB surface: pre-treatment (pickling and sandblasting) -> film mounting 2 -> exposure 2 -> single sided developing 2 -> electroforming 2 -> film stripping; electroforming a second electroformed layer (forming a down step area on a printing surface): printing surface film mounting -> exposure 3 -> single sided developing 3 -> electroforming 3 -> film stripping -> mold stripping -> subsequent treatment (degreasing and pickling). By using the process, the electroformed stencil having the PCB surface with up steps and the printing surface with up steps, wherein the up step areas has an opening pattern, can be produced. The openings of the pattern areas of the substrate and the step area have good quality, smooth hole walls and no blurs; the stencil surface has good quality, first class brightness, and no pinholes or pittings; the position precision of the opening area of the step area pattern and the opening area of the first electroformed layer is high; the binding strength between the up step area and the substrate is large, without the proneness of falling off; the thickness uniformity of the pattern areas of the electroformed stencil is good.

Description

technical field [0001] The invention relates to a manufacturing process of a step template, which belongs to the field of material manufacturing and processing, and specifically relates to an electroforming manufacturing process of a printing mask with a raised step area on the PCB surface and a concave step area on the printing surface in the field of PCB manufacturing . [0002] Background technique [0003] With the rapid development of my country's electronics industry, stencil printing technology has also been applied in the electronics manufacturing industry, and SMT printing is a typical example. The procurement of templates is not only the first step in the SMT assembly process, it is also the most important step. The main function of the stencil is to aid in the deposition of solder paste. The goal is to transfer the exact amount of material to the exact location on the light plate. The less solder paste blocks on the stencil, the more it deposits on the board. ...

AI Technical Summary

Problems solved by technology

For the technology of local thickening, the key point is that the opening position of the up step pattern area and the opening position of the substrate pattern area should have high precision, and at the same time, the bonding force should be strong, otherwise the service life will be greatly reduced

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