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Composite preparation process of three-dimensional vapor plating mask plate

A three-dimensional three-dimensional, preparation process technology, applied in the photoplate making process of the pattern surface, vacuum evaporation plating, metal material coating process and other directions, can solve problems such as deformation and product scrap, achieve simple process, smooth hole wall, The effect of broad market prospects

Inactive Publication Date: 2013-07-17
KUN SHAN POWER STENCIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the field of high-precision manufacturing, even the small convex and concave parts on the surface of the substrate will be affected by the mask and deformed, resulting in the scrapping of the product

Method used

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  • Composite preparation process of three-dimensional vapor plating mask plate
  • Composite preparation process of three-dimensional vapor plating mask plate
  • Composite preparation process of three-dimensional vapor plating mask plate

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0073] A specific process flow of a compound preparation process of a three-dimensional evaporation mask includes the following two steps:

[0074] A. The preparation process of the three-dimensional mandrel;

[0075] B. Preparation process of three-dimensional three-dimensional evaporation mask.

[0076] Specifically, the preparation process of the three-dimensional mandrel described in step A comprises the steps of:

[0077] Mandrel processing → pre-treatment (degreasing, pickling, sandblasting) → double-sided film coating → single-sided exposure a → single-sided development a → single-sided etching → stripping → post-treatment of core mold (degreasing, pickling)

[0078] More specifically, the technological process described in each step is as follows:

[0079] (1) Mandrel processing: select a 1.8mm thick stainless steel plate as the mandrel material, and cut the mandrel into a size of 800mm×600mm;

[0080] (2) Pretreatment: Degrease, pickle and sandblast the mandrel to ...

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Abstract

The invention relates to a composite preparation process of a three-dimensional vapor plating mask plate. The invention is characterized in that the preparation process comprises the steps of: A. a preparation technology of a three-dimensional core mould; and B. a preparation technology of the three-dimensional vapor plating mask plate. The three-dimensional vapor plating mask plate produced by the composite preparation process of a three-dimensional vapor plating mask plate provided by the invention has a recessed area and a raised area, the plating layer has good surface quality, no pit or pinhole, the raised area is not easy to fall off, the cost is low, the process is simple and saves energy, the opening precision is high, the opening quality is good, and the hole wall is smooth, so that the process has broad market prospects.

Description

technical field [0001] The invention designs a composite preparation process of a metal mask, belongs to the technical field of material preparation and processing, and specifically relates to a composite preparation process of a metal mask for three-dimensional vapor deposition. Background technique [0002] With the increasing abundance of OLED products, a single flat screen can no longer meet the needs of the existing market. Nowadays, the market demand is more and more pursuing individuality and fashion, and the products have gradually developed from a single plane in the past to curved surfaces, high and low countertops, and accompanied by hollow or raised designs. In the field of high-precision manufacturing, even the small convex and concave parts on the surface of the substrate will be affected by the mask and deformed, resulting in the scrapping of the product. In the existing evaporation process, only the use of the two-dimensional evaporation mask is used, and it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/04C23C14/24C25D1/10C25D3/12G03F7/00
Inventor 魏志凌高小平郑庆靓王峰
Owner KUN SHAN POWER STENCIL
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