A hybrid production process for a step stencil

A manufacturing process and step technology, which is applied in the field of material manufacturing and processing, can solve the problems that the size and quality of the steel mold opening cannot meet the requirements and the quality of the board surface is not good enough, and achieve the effect of good opening quality, large bonding force and high position accuracy.

Inactive Publication Date: 2013-07-17
KUN SHAN POWER STENCIL
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the opening size and quality of the steel mold made by the traditional process through laser cutting technology cannot meet the requirements, and the quality of the board surface is not good enough.

Method used

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  • A hybrid production process for a step stencil
  • A hybrid production process for a step stencil
  • A hybrid production process for a step stencil

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Embodiment Construction

[0085] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0086] The specific technological process of this legal name and the attention problem in technological process among the present invention will be more detailed in the following narration.

[0087] A hybrid manufacturing method for step formwork. Its technological process is as follows:

[0088] Electroforming the first electroforming layer: core mold treatment → pretreatment (degreasing, pickling, sandblasting) → film 1 → exposure 1 → single-sided development 1 → electroforming 1 → stripping;

[0089] Electroformed printed surface ra...

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Abstract

A hybrid production process for a step stencil. Specifically, The process flow is as follows: electroforming a first electroformed layer: core mold treatment->pre-treatment (degreasing, pickling and sandblasting)->film mounting 1->exposure 1->single sided development 1-> electroforming 1->stripping; electroforming up steps on a printing surface: pre-treatment (pickling and sandblasting)->double sided film mounting->double sided exposure->double sided development->electroforming 2->stripping; and etching down steps on a PCB surface: PCB surface etching->film stripping->follow-up treatment (degreasing and pickling). By employing the process, a metal stencil having the PCB surface with down steps and the printing surface with up steps can be produced. The pattern areas of the metal stencil have openings with good quality, smooth hole walls, and no undesirable phenomena of blurs, jags, etc.; the position precision of the opening pattern area is high; and the thickness uniformity of the stencil is good, uniformity COV being less than 10%.

Description

technical field [0001] The invention relates to a mixed manufacturing process of a stepped template, which belongs to the field of material manufacturing and processing, and in particular to a manufacturing process of a printing mask plate with raised steps on the printing surface and concave steps on the PCB surface in the field of PCB manufacturing. [0002] Background technique [0003] With the pursuit of miniaturization of electronic products, the perforated plug-in components used before can no longer be reduced; the functions of electronic products are more complete, and the integrated circuits (ICs) used can no longer perforate components, especially large-scale and highly integrated ICs, which have to use surface SMT components, so the stencil printing process has developed rapidly in the electronics manufacturing industry, and SMT printing is a typical example. The procurement of templates is not only the first step in the SMT assembly process, but also the most i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41C1/12B41N1/04B41N3/00G03F7/00
Inventor 魏志凌高小平孙倩
Owner KUN SHAN POWER STENCIL
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